公开(公告)号：US10825753B2

公开(公告)日：2020-11-03

申请号：US16162523

申请日：2018-10-17

Applicant: NEXPERIA B.V.

Inventor： Adam R. Brown ,  Ricardo L. Yandoc

IPC: H01L23/495 ,  H01L25/07

Abstract: The present disclosure relates to a semiconductor device and a method of manufacturing a semiconductor device. The semiconductor device including first and second semiconductor dies arranged on respective and first and second carriers, the first and second semiconductor dies each comprising a first contact and a second contact arranged on a top major surface of the respective semiconductor dies and a third contact arranged on a bottom major surface the respective semiconductor dies; first and second die connection portions, arranged on the respective first and second carriers, connected to the third contacts of the respective first and second semiconductor dies; and a first contact connection member, extending from the first contact of the first semiconductor die to the die connection portion of second carrier, electrical connection of the first contact of the first semiconductor die to the third contact of the second semiconductor die.