公开(公告)号：US11545379B2

公开(公告)日：2023-01-03

申请号：US16945079

申请日：2020-07-31

Applicant: NANYA TECHNOLOGY CORPORATION

Inventor： Sun-Fu Chou

IPC: H01L21/673 ,  G01M3/32 ,  G06N5/04 ,  G08B21/18 ,  G06N20/00 ,  G08B31/00

Abstract: The present disclosure provides systems and methods for controlling a semiconductor manufacturing equipment. A control system includes a sensor unit capturing a set of data related to a gas pressure in the equipment, a sensor interface receiving the set of data and generating at least one input signal for a database server, and a control unit. The control unit includes a front end subsystem, a calculation subsystem, and a message and feedback subsystem. The front end subsystem performs a front end process to generate a data signal. The calculation subsystem performs an artificial intelligence analytical process to determine, according to the data signal, whether a malfunction related to the gas pressure has occurred and generate an output signal. The message and feedback subsystem generates an alert signal and a feedback signal according to the output signal and transmits the alert signal to a user.

公开(公告)号：US12100605B2

公开(公告)日：2024-09-24

申请号：US18381898

申请日：2023-10-19

Applicant: NANYA TECHNOLOGY CORPORATION

Inventor： Meng-Liang Wei ,  Sun-Fu Chou

IPC: H01L21/673 ,  H01L21/02

CPC classification number: H01L21/67393 ,  H01L21/02046

Abstract: A gas purge device includes a first nozzle and a gas gate. The first nozzle is coupled to a front-opening unified pod (FOUP) through a first port of the FOUP. The gas gate is coupled to the first nozzle via a first pipe. The gas gate includes a first mass flow controller (MFC), a second MFC, and a first switch unit. The first MFC is configured to control a first flow of a first gas. The second MFC is configured to control a second flow of a second gas. The first switch unit is coupled to the first MFC and the second MFC, and is configured to provide the first gas to the first nozzle through the first pipe or receive the second gas from the first nozzle through the first pipe according to a process configuration.

公开(公告)号：US12027399B2

公开(公告)日：2024-07-02

申请号：US17077849

申请日：2020-10-22

Applicant: NANYA TECHNOLOGY CORPORATION

Inventor： Meng-Liang Wei ,  Sun-Fu Chou

IPC: H01L21/673 ,  H01L21/02

CPC classification number: H01L21/67393 ,  H01L21/02046

Abstract: The present disclosure provides a gas purge device and a gas purge method for purging a wafer container to clean wafers. The gas purge device includes a first nozzle and a gas gate. The first nozzle is coupled to a front-opening unified pod (FOUP) through a first port of the FOUP. The gas gate is coupled to the first nozzle via a first pipe. The gas gate includes a first mass flow controller (MFC), a second MFC, and a first switch unit. The first MFC is configured to control a first flow of a first gas. The second MFC is configured to control a second flow of a second gas. The first switch unit is coupled to the first MFC and the second MFC, and is configured to provide the first gas to the first nozzle through the first pipe or receive the second gas from the first nozzle through the first pipe according to a process configuration.

公开(公告)号：US11631604B2

公开(公告)日：2023-04-18

申请号：US16932444

申请日：2020-07-17

Applicant: NANYA TECHNOLOGY CORPORATION

Inventor： Jih-Cheng Huang ,  Sun-Fu Chou

IPC: H01L21/673 ,  H01L21/67

Abstract: The present disclosure provides a load port device, a gas gate and a gas-providing method. The load port device includes a gas-providing nozzle and the gas gate. The gas-providing nozzle is used for providing gas to a wafer container. The gas gate includes a plurality of gas inlet ports, a gas-providing port and a controller. Each gas inlet port connects to a gas source. The gas-providing port connects to the gas-providing nozzle. The controller is configured to: select one of the plurality of gas inlet ports; and connect the selected gas inlet port to the gas-providing port.