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公开(公告)号：US10811194B2
公开(公告)日：2020-10-20
申请号：US16372468
申请日：2019-04-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto , Shinichiro Kuroiwa
Abstract: A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.
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公开(公告)号：US10014111B2
公开(公告)日：2018-07-03
申请号：US14661018
申请日：2015-03-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto
IPC: H01G4/30 , H01G4/228 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/12 , H01G4/232 , H05K1/14 , H01F27/29 , H05K1/18 , H05K1/11 , H05K3/00
CPC classification number: H01G4/30 , H01C1/14 , H01C7/18 , H01F27/292 , H01G2/065 , H01G4/12 , H01G4/228 , H01G4/232 , H05K1/113 , H05K1/141 , H05K1/181 , H05K3/0097 , H05K2201/049 , H05K2201/09181
Abstract: An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.
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公开(公告)号：US09947466B2
公开(公告)日：2018-04-17
申请号：US14663725
申请日：2015-03-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto , Hirobumi Adachi
CPC classification number: H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K3/403 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.
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公开(公告)号：US09374901B2
公开(公告)日：2016-06-21
申请号：US13960829
申请日：2013-08-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto
CPC classification number: H05K1/18 , H01G2/065 , H01G4/232 , H01G4/30 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/611
Abstract: In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of the first and second bonding portions in a lengthwise direction of the monolithic capacitor is about 0.2 times to about 0.5 times a length of an elementary body in the lengthwise direction, and a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from a center of the elementary body in the lengthwise direction. Vibration noise is changed depending on positions of outer electrodes of the monolithic capacitor, the outer electrodes being used to bond the monolithic capacitor to a mounting substrate.
Abstract translation: 在单体电容器安装结构中，假设与第一接合材料接合的第一外部电极的一部分是第一接合部分，并且与第二接合材料接合的第二外部电极的一部分是第二接合部分， 单片电容器的长度方向上的第一接合部和第二接合部中的每一个在长度方向上为基本体的长度的约0.2倍〜约0.5倍，长度方向上的第一接合部和第二接合部的中心 方向位于与基本体的长度方向的中心不同的位置。 振动噪声根据单体电容器的外部电极的位置而变化，外部电极用于将单片电容器接合到安装基板。
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公开(公告)号：US08791673B2
公开(公告)日：2014-07-29
申请号：US13629754
申请日：2012-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto
IPC: G05F1/00
CPC classification number: G05F1/46 , H02M3/1588 , H02M2001/0009 , Y02B70/1466
Abstract: In a power supply apparatus that supplies direct current power to a load with a power supply unit, since a load power supply current is detected by a current detector from a voltage between both ends of a through electrode of a three-terminal capacitor provided on a power feed line extending from a power supply unit to a load, the three-terminal capacitor serving as a filter to reduce ripple noise can be used also as a detection resistor for detecting the load power supply current. Accordingly, it is possible to detect the load power supply current with a simple configuration that does not require a resistance element to detect the load power supply current, unlike in the related art. Consequently, it is not necessary to ensure an area where the resistance element for current detection can be mounted to reduce a power supply apparatus in size.
Abstract translation: 在向电源单元向负载提供直流电力的电源装置中，由于电流检测器由设置在电源单元上的三端电容器的贯通电极的两端之间的电压检测出负载电源电流 供电线从电源单元延伸到负载，用作滤波器以减小纹波噪声的三端电容器也可以用作用于检测负载电源电流的检测电阻器。 因此，与现有技术不同，可以以不需要电阻元件的简单结构来检测负载电源电流来检测负载电源电流。 因此，不需要确保可以安装用于电流检测的电阻元件的区域，以减小电源装置的尺寸。
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Patent Agency Ranking
公开(公告)号：US10143087B2
公开(公告)日：2018-11-27
申请号：US15586310
申请日：2017-05-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto
IPC: H01G4/012 , H01G4/018 , H01G4/30 , H05K1/18 , H01G4/232 , H01G4/38 , H01G4/40 , H01G2/06 , H01G4/224
Abstract: A circuit module includes a first and second monolithic ceramic capacitors encapsulated by a mold resin layer on a wiring board. The first and second monolithic ceramic capacitors are lined up along a direction parallel or substantially parallel to the main surface of the wiring board and are electrically connected in series or in parallel through a conductive pattern provided on the wiring board. One of a pair of end surfaces of the first monolithic ceramic capacitor is opposed to one of the width-direction side surfaces as a pair of side surfaces of the second monolithic ceramic capacitor with the mold resin layer interposed.
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公开(公告)号：US09867278B2
公开(公告)日：2018-01-09
申请号：US13959938
申请日：2013-08-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto , Toshiki Tanaka
CPC classification number: H05K1/0216 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: Laminated ceramic capacitors include ceramic layers and inner electrodes that are alternately laminated. The inner electrodes are laminated in the same lamination direction, and a first outer electrode and a second outer electrode are electrically connected to the inner electrodes. In a mounting process, the laminated ceramic capacitors are mounted on a mounting surface such that the inner electrodes are perpendicular or substantially perpendicular to the mounting surface.
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公开(公告)号：US09552923B2
公开(公告)日：2017-01-24
申请号：US14726785
申请日：2015-06-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto
CPC classification number: H01G2/065 , H01G2/06 , H01G4/12 , H05K1/141 , H05K1/181 , H05K3/3442 , H05K2201/049 , H05K2201/09181 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor. A first mounting electrode to mount the multilayer ceramic capacitor is located on a first principal surface of the substrate, and a first external connection electrode for connection to an external circuit board is located on a second principal surface. A recess is located in a side surface of the interposer. A connecting conductor is located in the wall surface of the recess. The connecting conductor is located at a position spaced apart by a predetermined distance from the side surface of the interposer.
Abstract translation: 多层陶瓷电容器包括彼此层叠的平坦的内部电极。 插入器包括比多层陶瓷电容器大的衬底。 安装多层陶瓷电容器的第一安装电极位于基板的第一主表面上，并且用于连接到外部电路板的第一外部连接电极位于第二主表面上。 凹槽位于插入器的侧表面中。 连接导体位于凹部的壁表面中。 连接导体位于与插入件的侧表面间隔开预定距离的位置处。
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9.发明授权Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure 有权制造安装有单片陶瓷电容器的安装基板的制造方法和安装结构公开(公告)号：US09338889B2
公开(公告)日：2016-05-10
申请号：US14050842
申请日：2013-10-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Isamu Fujimoto , Norio Shiroiwa
CPC classification number: H05K1/181 , H01G2/065 , H01G4/232 , H01G4/30 , H05K1/111 , H05K3/303 , H05K3/3415 , H05K3/3442 , H05K2201/10015 , H05K2201/10545 , H05K2201/2045 , Y02P70/611 , Y02P70/613 , Y10T29/4913
Abstract: A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of substantially planar inner electrodes are stacked on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes and provided on a surface of the multilayer body are mounted on a circuit board includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other.
Abstract translation: 一种制造安装基板的方法，其中，一对叠层陶瓷电容器包括多层体，其中多个介电陶瓷片和多个基本上平面的内电极彼此堆叠并且至少一对 电连接到内部电极并设置在多层体的表面上的外部电极安装在电路板上，包括将外部电极连接到形成在电路板的前后表面上的平台， 前表面形成在与形成在后表面上的相应焊盘的位置平面对称的位置处，同时电连接到形成在后表面上的相应焊盘，使得内电极的平面的表面方向彼此匹配。
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公开(公告)号：US09241408B2
公开(公告)日：2016-01-19
申请号：US13927251
申请日：2013-06-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo Hattori , Tadateru Yamada , Isamu Fujimoto
CPC classification number: H05K1/18 , H01G2/02 , H01G2/06 , H05K1/181 , H05K3/3442 , H05K2201/09145 , H05K2201/10015 , H05K2201/10378 , H05K2201/2045 , Y02P70/611
Abstract: In an electronic component, upper surface electrodes are located on one main surface of an insulating substrate of an interposer on which a multilayer ceramic capacitor is mounted. The insulating substrate has substantially the same shape as that of the multilayer ceramic capacitor, viewed from a direction perpendicular or substantially perpendicular to the main surface, and has the multilayer ceramic capacitor mounted thereon so that the length direction of the multilayer ceramic capacitor substantially coincides with the length direction of the insulating substrate. The insulating substrate includes cutouts that include connection electrodes, respectively, and that are located at the four corners viewed from the direction perpendicular or substantially perpendicular to the main surface. The upper surface electrodes on the one main surface are connected via the connection electrodes to lower surface electrodes, respectively, that are located on the other main surface and are connected to a circuit board.
Abstract translation: 在电子部件中，上表面电极位于其上安装有多层陶瓷电容器的插入器的绝缘基板的一个主表面上。 绝缘基板的形状与多层陶瓷电容器的形状基本相同，从与主表面垂直或大致垂直的方向观察，并将多层陶瓷电容器安装在其上，使多层陶瓷电容器的长度方向基本上与 绝缘基板的长度方向。 绝缘基板包括分别包括连接电极并且位于从垂直于或基本上垂直于主表面的方向观察的四个拐角处的切口。 一个主表面上的上表面电极经由连接电极分别连接到位于另一个主表面上并连接到电路板的下表面电极。
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