公开(公告)号：US11031358B2

公开(公告)日：2021-06-08

申请号：US15909684

申请日：2018-03-01

Applicant: MARVELL INTERNATIONAL LTD.

Inventor： Aarthi Sridharan ,  Gong Cheng ,  Premachandran Chirayarikathuveedu ,  Fahad Mirza ,  Carole Graas ,  Sricharan Tubati ,  Nurul Islam Mohd

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/768 ,  H01L21/02

Abstract: A method for forming a sensor with increased overhang to prevent passivation stress fractures is provided. Embodiments include forming a first passivation layer over a dielectric layer patterned over a first top metal layer of a logic region of a sensor and a second top metal layer of an array region of the sensor; planarizing the first passivation layer and the dielectric layer to form a level surface above the first top metal layer and the second top metal layer; etching the dielectric layer to form a pad opening in the array region of the sensor based on a predetermined overhang value, the pad opening exposing a portion of the surface of the second top metal layer; and forming a second passivation layer over the level surface and the pad opening in the array region.