公开(公告)号：US09271425B1

公开(公告)日：2016-02-23

申请号：US14514379

申请日：2014-10-15

Applicant: Lanner Electronic Inc.

Inventor： Tse-Min Lin

IPC: H05K5/00 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1492 ,  H05K7/20736

Abstract: The present invention relates to an industrial server system, comprising a housing, a backplane, at least one rear board, a first front board, a second front board, and a power supply, wherein the backplane and the power supply are disposed in the housing, and the rear board, the first front board, and the second front board are coupled and configured to the backplane. Four connected blocks are disposed on the backplane, which makes that at least one rear board, the first front board, and the second front board are able to communicate to each other by a plurality of data connecting units disposed on the backplane. The rear board, the first front board, and the second front board of the present invention can achieve a great transmission efficiency by a specific configuration of connected block on the backplane.

Abstract translation: 本发明涉及一种工业服务器系统，其包括壳体，背板，至少一个后板，第一前板，第二前板和电源，其中背板和电源设置在壳体 ，并且后板，第一前板和第二前板被耦合并配置到背板。 四个连接块设置在背板上，这使得至少一个后板，第一前板和第二前板能够通过设置在背板上的多个数据连接单元彼此通信。 本发明的后板，第一前板和第二前板可以通过背板上的连接块的特定配置来实现良好的传输效率。

公开(公告)号：US09363927B2

公开(公告)日：2016-06-07

申请号：US14484264

申请日：2014-09-12

Applicant: Lanner Electronic Inc.

Inventor： Tse-Min Lin ,  Wen-Lung Lee

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20736 ,  H05K7/1492

Abstract: The present invention is an electrical signal computing module capable of accommodating printed circuit board, able to lead the exterior air into the main case body, exchange heat with the printed circuit boards, without accumulation of heat and damage of the printed circuit board. The present invention has a main case body with a bottom case and an internal board set, and four accommodating areas are formed by the internal board set and a transmission circuit board, in addition, numerous flow holes disposed at specific position are designed for air flowing in, exchanging heat produced by printed circuit boards as well.

Abstract translation: 本发明是一种能够容纳印刷电路板的电信号计算模块，其能够将外部空气引导到主壳体中，与印刷电路板交换热量，而不会积聚热量并损坏印刷电路板。 本发明的主壳体具有底壳和内板组，并且由内板组和传输电路板形成四个容纳区域，另外设置在特定位置的多个流动孔用于空气流动 也可以交换印刷电路板产生的热量。