-
公开(公告)号:US10741848B2
公开(公告)日:2020-08-11
申请号:US15914568
申请日:2018-03-07
Applicant: LS MTRON LTD.
Inventor: Seung Min Kim , Shan Hua Jin
IPC: H01M4/66 , H01M4/133 , C25D3/38 , C25D7/06 , C25D1/04 , C23C22/37 , C25D5/04 , C25D5/48 , C25D1/20 , H01M4/13 , H01M4/587 , H01M4/48 , H01M4/02 , H01M10/0525 , H01M4/36
Abstract: Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 μm to 3.5 μm, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
-
公开(公告)号:US10547081B2
公开(公告)日:2020-01-28
申请号:US15662785
申请日:2017-07-28
Applicant: LS Mtron Ltd.
Inventor: Seung Min Kim , Shan Hua Jin
IPC: H01M10/0562 , H01M4/04 , H01M4/38 , C25D1/20 , C25D1/00 , C25D1/04 , C25D3/38 , C25D7/06 , H01M10/0525
Abstract: An electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first surface has a peak density (PD) of 3 to 110, a texture coefficient [TC(220)] of a (220) plane of 1.32 or less, and a surface roughness (Rz) of 0.5 to 2.7 μm.
-
公开(公告)号:US10403898B2
公开(公告)日:2019-09-03
申请号:US15661266
申请日:2017-07-27
Applicant: LS Mtron Ltd.
Inventor: Seung Min Kim , Jeong Gil Lee , Shan Hua Jin
Abstract: A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.
-
-