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公开(公告)号：US09023671B2
公开(公告)日：2015-05-05
申请号：US14166946
申请日：2014-01-29
Applicant: Lightizer Korea Co.
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
CPC classification number: H01L33/50 , H01L33/501 , H01L33/505 , H01L2933/0041
Abstract: Disclosed herein is a method of disposing phosphor layers, which can prevent damage to phosphors and also effectively dispose phosphor layers at desired locations of Light-Emitting Diodes (LEDs) when the phosphor layers are detached and disposed at the top surfaces of the LEDs. According to an embodiment, phosphor layers fabricated by filling phosphor layer pattern holes within an area of the vertical frame with a phosphor solution are detached from the phosphor layer pattern holes by applying force downwardly or upwardly in a vertical manner.
Abstract translation: 本文公开了一种设置荧光体层的方法，其可以防止荧光体的损坏，并且当荧光体层被分离并设置在LED的顶表面处时，在发光二极管（LED）的期望位置处有效地设置荧光体层。 根据实施例，通过用荧光体溶液在垂直框架的区域内填充荧光体层图案孔而制造的荧光体层通过以垂直方式向下或向上施加力而从荧光体层图案孔分离。
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公开(公告)号：US09929309B2
公开(公告)日：2018-03-27
申请号：US14609777
申请日：2015-01-30
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
CPC classification number: H01L33/0095 , H01L33/44 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/641 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.
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公开(公告)号：US09525112B2
公开(公告)日：2016-12-20
申请号：US14013437
申请日：2013-08-29
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Byoung Gu Cho
CPC classification number: H01L33/52 , H01L33/0095 , H01L2933/0041
Abstract: The present invention provides a method of manufacturing a phosphor for a light-emitting diode, including filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution including a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, polishing a top surface of the phosphor frame filled with the fluorescent material solution, and drying the phosphor frame filled with the fluorescent material solution and polished.
Abstract translation: 本发明提供一种制造发光二极管的荧光体的方法，包括用荧光材料溶液填充其中以雕刻形式形成荧光体模型的荧光体框架，所述荧光体溶液包括荧光材料，所述荧光材料溶液转换由发光 通过改变由发光二极管提供的光的波长来二极管变成白光，研磨填充有荧光材料溶液的荧光体框架的顶表面，并干燥填充有荧光材料溶液的荧光体框架并进行抛光。
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公开(公告)号：US20150311408A1
公开(公告)日：2015-10-29
申请号：US14609777
申请日：2015-01-30
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
CPC classification number: H01L33/0095 , H01L33/44 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/641 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.
Abstract translation: 本发明公开了根据本发明实施例的发光二极管（LED）封装，其包括被配置为提供具有特定区域的波长的光的LED，通过形成的接合焊盘与LED电连接的电路板 在LED的底部，形成为盖的磷光体层，设置成围绕LED的侧面和顶部，并且被配置为具有形成为均匀厚度的侧面和顶部，以及设置在LED的顶部之间的缓冲层 LED和荧光体层的底部，并且被配置为抑制从LED的顶部产生的热量被转移到荧光体层的底部并且防止荧光体层的底部偏离LED的顶部 。
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公开(公告)号：US20150093843A1
公开(公告)日：2015-04-02
申请号：US14166946
申请日：2014-01-29
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
IPC: H01L33/50
CPC classification number: H01L33/50 , H01L33/501 , H01L33/505 , H01L2933/0041
Abstract: Disclosed herein is a method of disposing phosphor layers, which can prevent damage to phosphors and also effectively dispose phosphor layers at desired locations of Light-Emitting Diodes (LEDs) when the phosphor layers are detached and disposed at the top surfaces of the LEDs. According to an embodiment, phosphor layers fabricated by filling phosphor layer pattern holes within an area of the vertical frame with a phosphor solution are detached from the phosphor layer pattern holes by applying force downwardly or upwardly in a vertical manner.
Abstract translation: 本文公开了一种设置荧光体层的方法，其可以防止荧光体的损坏，并且当荧光体层被分离并设置在LED的顶表面处时，在发光二极管（LED）的期望位置处有效地设置荧光体层。 根据实施例，通过用荧光体溶液在垂直框架的区域内填充荧光体层图案孔而制造的荧光体层通过以垂直方式向下或向上施加力而从荧光体层图案孔分离。
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Patent Agency Ranking
公开(公告)号：US09130132B2
公开(公告)日：2015-09-08
申请号：US14013426
申请日：2013-08-29
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Byoung Gu Cho
CPC classification number: H01L33/507 , H01L33/502 , H01L33/505
Abstract: The present invention provides a package for a light-emitting device, including the light-emitting device configured to provide light having a specific wavelength region, electrode pads formed on the light-emitting device, and a phosphor layer formed over the light-emitting device other than regions where the electrode pads are formed and configured to convert the light of the light-emitting device into white light by changing the wavelength of the light provided by the light-emitting device, wherein the phosphor layer is formed in a conformable thickness and is formed in a region wider than an upper region of the light-emitting device other than the regions where the electrode pads are formed.
Abstract translation: 本发明提供了一种发光装置的封装，其包括：发光元件，其配置为提供具有特定波长区域的光，形成在发光元件上的电极焊盘;以及形成在发光元件上的荧光体层 除了形成电极焊盘的区域之外，通过改变由发光器件提供的光的波长，将发光器件的光转换成白光，其中荧光体层形成为一致的厚度，并且 形成在除了形成电极焊盘的区域之外的比发光器件的上部区域宽的区域中。
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公开(公告)号：US20140084321A1
公开(公告)日：2014-03-27
申请号：US14013426
申请日：2013-08-29
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Byoung Gu Cho
IPC: H01L33/50
CPC classification number: H01L33/507 , H01L33/502 , H01L33/505
Abstract: The present invention provides a package for a light-emitting device, including the light-emitting device configured to provide light having a specific wavelength region, electrode pads formed on the light-emitting device, and a phosphor layer formed over the light-emitting device other than regions where the electrode pads are formed and configured to convert the light of the light-emitting device into white light by changing the wavelength of the light provided by the light-emitting device, wherein the phosphor layer is formed in a conformable thickness and is formed in a region wider than an upper region of the light-emitting device other than the regions where the electrode pads are formed.
Abstract translation: 本发明提供了一种发光装置的封装，其包括：发光元件，其配置为提供具有特定波长区域的光，形成在发光元件上的电极焊盘;以及形成在发光元件上的荧光体层 除了形成电极焊盘的区域之外，通过改变由发光器件提供的光的波长，将发光器件的光转换成白光，其中荧光体层形成为一致的厚度，并且 形成在除了形成电极焊盘的区域之外的比发光器件的上部区域宽的区域中。
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公开(公告)号：US09942963B2
公开(公告)日：2018-04-10
申请号：US14013452
申请日：2013-08-29
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
IPC: H05B33/10
CPC classification number: H05B33/10 , H01L2933/0041
Abstract: The present invention relates to an apparatus for manufacturing fluorescent layers and, more particularly, to an apparatus for manufacturing fluorescent layers, which converts light from a light-emitting diode into white light by varying a wavelength of the light emitted from the light-emitting diode. The present invention provides the apparatus for manufacturing fluorescent layers includes a vertical frame and a fluorescent layer pattern hole formed in a direction vertical to the vertical frame in a fluorescent layer pattern form within the vertical frame.
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公开(公告)号：US09590156B2
公开(公告)日：2017-03-07
申请号：US14618114
申请日：2015-02-10
Applicant: LIGHTIZER KOREA CO.
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
CPC classification number: H01L33/62 , H01L33/501 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/16152 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.
Abstract translation: 本发明提供一种发光二极管（LED）封装，其包括：形成有一组焊盘的基板; LED元件，被配置为提供预定波长区域的光，其具有形成在其顶表面上并附着在所述基板的顶表面上的一组芯片焊盘; 将基板的焊盘与LED元件的芯片焊盘连接的一组金线; 形成为帽状的荧光体层，其具有均匀厚度的侧面和顶部，并且被配置为围绕LED元件的侧面和顶表面间隔开; 以及填充物，用于填充在所述荧光体层和所述LED元件之间形成的空间，其中，所述LED元件，所述金线以及所述基板的所述接合焊盘位于所述荧光体层帽的下方。
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公开(公告)号：US20160118559A1
公开(公告)日：2016-04-28
申请号：US14618114
申请日：2015-02-10
Applicant: LIGHTIZER KOREA CO
Inventor： Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
CPC classification number: H01L33/62 , H01L33/501 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/16152 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.
Abstract translation: 本发明提供一种发光二极管（LED）封装，其包括：形成有一组焊盘的基板; LED元件，被配置为提供预定波长区域的光，其具有形成在其顶表面上并附着在所述基板的顶表面上的一组芯片焊盘; 将基板的焊盘与LED元件的芯片焊盘连接的一组金线; 形成为帽状的荧光体层，其具有均匀厚度的侧面和顶部，并且被配置为围绕LED元件的侧面和顶表面间隔开; 以及填充物，用于填充在所述荧光体层和所述LED元件之间形成的空间，其中，所述LED元件，所述金线以及所述基板的所述接合焊盘位于所述荧光体层帽的下方。
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