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公开(公告)号：US10608356B2
公开(公告)日：2020-03-31
申请号：US16117720
申请日：2018-08-30
Applicant: L3 Technologies, Inc.
Inventor： Matthew J. Spitzner
Abstract: Multiple node bus bar contacts for high-power electronic assemblies are disclosed. The electronic assembly includes a plurality of circuit card assemblies (CCAs) for an electronic assembly, a plurality of socket connectors coupled within the plurality of CCAs, and a bus bar contact. The bus bar contact includes a rod positioned to extend through two or more socket connectors within two or more CCAs where the rod is in electrical contact with the two or more socket connectors, and the bus bar contact includes a bar coupled to the rod and having a first portion routed to an outer edge of the electronic assembly. In addition, the bar can also include a second portion with a connector, and the connector can be coupled to a bus bar providing electrical current for the electronic assembly. Further, a plurality of bus bar contacts can also be included within the electronic assembly.
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Patent Agency Ranking
公开(公告)号：US20200076100A1
公开(公告)日：2020-03-05
申请号：US16117720
申请日：2018-08-30
Applicant: L3 Technologies, Inc.
Inventor： Matthew J. Spitzner
Abstract: Multiple node bus bar contacts for high-power electronic assemblies are disclosed. The electronic assembly includes a plurality of circuit card assemblies (CCAs) for an electronic assembly, a plurality of socket connectors coupled within the plurality of CCAs, and a bus bar contact. The bus bar contact includes a rod positioned to extend through two or more socket connectors within two or more CCAs where the rod is in electrical contact with the two or more socket connectors, and the bus bar contact includes a bar coupled to the rod and having a first portion routed to an outer edge of the electronic assembly. In addition, the bar can also include a second portion with a connector, and the connector can be coupled to a bus bar providing electrical current for the electronic assembly. Further, a plurality of bus bar contacts can also be included within the electronic assembly.
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公开(公告)号：US11985758B2
公开(公告)日：2024-05-14
申请号：US17216603
申请日：2021-03-29
Applicant: L3 Technologies, Inc.
Inventor： Matthew J. Spitzner , Fernando Ortiz
CPC classification number: H05K1/0209 , H05K3/3463 , H05K7/20481
Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.
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公开(公告)号：US20210219417A1
公开(公告)日：2021-07-15
申请号：US17216603
申请日：2021-03-29
Applicant: L3 Technologies, Inc.
Inventor： Matthew J. Spitzner , Fernando Ortiz
Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.
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公开(公告)号：US10973114B2
公开(公告)日：2021-04-06
申请号：US16173523
申请日：2018-10-29
Applicant: L3 Technologies, Inc.
Inventor： Matthew J. Spitzner , Fernando Ortiz
Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.
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公开(公告)号：US10206294B2
公开(公告)日：2019-02-12
申请号：US15449247
申请日：2017-03-03
Applicant: L3 Technologies Inc.
Inventor： David Nail , Matthew J. Spitzner , Joel B. Gorman
Abstract: An electronic apparatus comprising: 1) a first circuit board; 2) a second circuit board substantially parallel to the first circuit board; and 3) an electrical assembly coupled between the first and second boards. The electrical assembly comprises: i) a housing; ii) a plurality of pogo pin connectors disposed within and projecting from the housing and configured to make electrical contact with the first and second circuit boards; and iii) a plurality of capacitors disposed within the housing and configured to form electrical connections with selected ones of the plurality of pogo pin connectors.
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