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公开(公告)号：US11855344B2
公开(公告)日：2023-12-26
申请号：US17389342
申请日：2021-07-30
Applicant: KMW INC.
Inventor： Min Sik Park , Jun Woo Yang , Bung Chul Kim , In Ho Kim
Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.
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公开(公告)号：US12300879B2
公开(公告)日：2025-05-13
申请号：US18387486
申请日：2023-11-07
Applicant: KMW INC.
Inventor： Min Sik Park , Jun Woo Yang , Bung Chul Kim , In Ho Kim
Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.
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公开(公告)号：US11233308B2
公开(公告)日：2022-01-25
申请号：US16892275
申请日：2020-06-03
Applicant: KMW INC.
Inventor： Duk Yong Kim , Jun Woo Yang , Jin Soo Yeo , Chang Woo Yoo , Min Sik Park , Hye Yeon Kim
IPC: H01Q1/02 , H01Q1/42 , H01Q1/22 , H01Q1/40 , H04B7/0413
Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.
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Patent Agency Ranking
公开(公告)号：US11324106B2
公开(公告)日：2022-05-03
申请号：US16894735
申请日：2020-06-05
Applicant: KMW INC.
Inventor： Duk Yong Kim , Jun Woo Yang , Jin Soo Yeo , Chang Woo Yoo , Min Sik Park , Hye Yeon Kim
IPC: H05K1/02 , H05K1/18 , H01L23/427 , H01L23/467 , H05K7/20
Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.
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公开(公告)号：US11266041B2
公开(公告)日：2022-03-01
申请号：US16893394
申请日：2020-06-04
Applicant: KMW INC.
Inventor： Duk Yong Kim , Jun Woo Yang , Jin Soo Yeo , Chang Woo Yoo , Min Sik Park , Hye Yeon Kim
Abstract: A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe. The unit heat pipe includes one end which is connected to the outer surface of the cooling cover and another end to which a plurality of cooling ribs are formed to extend outward in a radial direction from an outer circumferential surface of the another end of the unit heat pipe.
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公开(公告)号：US20200305308A1
公开(公告)日：2020-09-24
申请号：US16893394
申请日：2020-06-04
Applicant: KMW INC.
Inventor： Duk Yong Kim , Jun Woo Yang , Jin Soo Yeo , Chang Woo Yoo , Min Sik Park , Hye Yeon Kim
Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and includes a printed circuit board which has a plurality of electronic elements mounted on one surface, at least one of the plurality of electronic elements generating heat at operation, a board case which accommodates the printed circuit board, a cooling cover which has the inner surface in close contact with the other surface of the printed circuit board while covering the board case, and a plurality of radial cooling bodies which have at least one provided to protrude from the outer surface of the cooling cover, are each formed to extend to be inclined upward, and receive heat generated from the printed circuit board to dissipate the heat outward, thereby increasing an effective cooling area on a limited cooling portion to largely improve cooling performance.
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公开(公告)号：US20200305270A1
公开(公告)日：2020-09-24
申请号：US16894735
申请日：2020-06-05
Applicant: KMW INC.
Inventor： Duk Yong Kim , Jun Woo Yang , Jin Soo Yeo , Chang Woo Yoo , Min Sik Park , Hye Yeon Kim
IPC: H05K1/02 , H05K1/18 , H05K7/20 , H01L23/427 , H01L23/467
Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and particularly, includes a printed circuit board which has a plurality of electronic elements provided on one surface thereof as a unit heat-generating element, a housing main body which has the other surface of the printed circuit board accommodated to be in close contact therewith, and has a plurality of first cooling ribs provided to protrude from the outer surface thereof, an additional cooling part which is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body, and a heat transfer part which has one end connected to the outer surface of the housing main body and the other end connected to the additional cooling part to transfer heat generated from the electronic element to the additional cooling part, thereby improving cooling performance.
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公开(公告)号：US20200295433A1
公开(公告)日：2020-09-17
申请号：US16892275
申请日：2020-06-03
Applicant: KMW INC.
Inventor： Duk Yong Kim , Jun Woo Yang , Jin Soo Yeo , Chang Woo Yoo , Min Sik Park , Hye Yeon Kim
IPC: H01Q1/02 , H01Q1/40 , H01Q1/22 , H04B7/0413
Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.
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