Abstract:
A method and device for determining, in a non-destructive way, at least the active carrier profile from an unknown semiconductor substrate are disclosed. In one aspect, the method comprises generating 2 m independent measurement values from the m reflected signals and correlating these 2 m measurement values with 2 m independent carrier profile values. The method further comprises generating additional 2 m measurement values to allow determining the active carrier profile and a second parameter profile by correlating the 4 m measurement values with the 4 m profile values. The method further comprises generating a total of 2 m[n.k] measurement values to allow determining [n.k] independent material parameter depth profiles, each material parameter profile having m points.
Abstract:
A method is disclosed for determining the inactive doping concentration of a semiconductor region using a PMOR method. In one aspect, the method includes providing two semiconductor regions having substantially the same known as-implanted concentration but known varying junction depths. The method includes determining on one of these semiconductor regions the as-implanted concentration. The semiconductor regions are then partially activated. PMOR measures are then performed on the partially activated semiconductor regions to measure (a) the signed amplitude of the reflected probe signal as function of junction depth and (b) the DC probe reflectivity as function of junction depth. The method includes extracting from these measurements the active doping concentration and then calculating the inactive doping concentration using the determined total as-implanted concentration and active doping concentration. The method may also include extracting thermal diffusivity, refraction index, absorption coefficient, and/or SRHF lifetime from these measurements.
Abstract:
A method and device for determining, in a non-destructive way, at least the active carrier profile from an unknown semiconductor substrate are disclosed. In one aspect, the method comprises generating 2m independent measurement values from the m reflected signals and correlating these 2m measurement values with 2m independent carrier profile values. The method further comprises generating additional 2m measurement values to allow determining the active carrier profile and a second parameter profile by correlating the 4m measurement values with the 4m profile values. The method further comprises generating a total of 2m[n.k] measurement values to allow determining [n.k] independent material parameter depth profiles, each material parameter profile having m points.
Abstract:
A method of determining a value of a depth of a semiconductor junction of a substrate using a photomodulated optical reflectance measurement technique is disclosed. In one aspect, the method includes obtaining a substrate which has at least a first region including the semiconductor junction. The method further includes obtaining a reference region. the method further includes performing at least one sequence of: a) selecting a set of measurement parameters for the photomodulated optical reflectance measurement, b) measuring on the at least a first region a first optical signal representative of the substrate with the semiconductor junction using the selected set of parameters, c) measuring on the reference region a second optical signal using the selected set of parameters, and d) determining the ratio of the first optical signal to the second optical signal, and thereafter extracting from the ratio the depth of the semiconductor junction.
Abstract:
A method of determining a value of a depth of a semiconductor junction of a substrate using a photomodulated optical reflectance measurement technique is disclosed. In one aspect, the method includes obtaining a substrate which has at least a first region including the semiconductor junction. The method further includes obtaining a reference region. the method further includes performing at least one sequence of: a) selecting a set of measurement parameters for the photomodulated optical reflectance measurement, b) measuring on the at least a first region a first optical signal representative of the substrate with the semiconductor junction using the selected set of parameters, c) measuring on the reference region a second optical signal using the selected set of parameters, and d) determining the ratio of the first optical signal to the second optical signal, and thereafter extracting from the ratio the depth of the semiconductor junction.