公开(公告)号：US12130096B2

公开(公告)日：2024-10-29

申请号：US17753215

申请日：2020-08-28

Applicant: JFE PRECISION CORPORATION ,  JFE STEEL CORPORATION

Inventor： Hoshiaki Terao ,  Kouichi Hashimoto ,  Raita Wada

IPC: F28F21/08 ,  H01L23/00 ,  H01L23/373 ,  B32B15/01 ,  H01L25/16

CPC classification number: F28F21/089 ,  H01L23/3735 ,  H01L24/32 ,  B32B15/018 ,  F28F2245/00 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32245 ,  H01L2224/48155 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/01042 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/15763

Abstract: Provided is a heat sink having a clad structure of Co—Mo composite materials and Cu materials, satisfying high heat-sink properties required of the heat sink for use in a semiconductor package with a frame on which a high-output and small-sized semiconductor is mounted, and preventing, when applied to the semiconductor package with a frame, crack of the frame due to local stress concentration. The heat sink has three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that the Cu layers are outermost layers on both sides thereof, the Cu layers as the outermost layers each having a thickness t1 of 40 μm or more, the heat sink satisfying 0.06≤t1/T≤0.27 (where T: heat sink thickness) and t2/T≤0.36/[(total number of layers−1)/2] (where t2: Cu—Mo composite layer thickness, the total number of layers: sum of numbers of Cu layers and Cu—Mo composite layers).

公开(公告)号：US11646243B2

公开(公告)日：2023-05-09

申请号：US16763983

申请日：2018-11-16

Applicant: JFE PRECISION CORPORATION

Inventor： Hoshiaki Terao ,  Kouichi Hashimoto

IPC: H01L23/373 ,  B32B15/01 ,  H01L21/48

CPC classification number: H01L23/3735 ,  B32B15/01 ,  H01L21/4882 ,  Y10T428/1291

Abstract: Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.

公开(公告)号：US11270926B2

公开(公告)日：2022-03-08

申请号：US16328426

申请日：2017-08-21

Applicant: JFE PRECISION CORPORATION

Inventor： Hoshiaki Terao ,  Kouichi Hashimoto

IPC: H01L23/373 ,  B32B15/20 ,  B22F3/10 ,  B22F7/06 ,  B22F7/08 ,  B23P15/26 ,  B32B15/01 ,  C22C1/04 ,  C22C27/04 ,  F28F21/08

Abstract: Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu—Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu—Mo composite layers or comprises three or more Cu—Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu—Mo composite layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.