公开(公告)号：US20150255551A1

公开(公告)日：2015-09-10

申请号：US14700203

申请日：2015-04-30

Applicant: Infineon Technologies AG

Inventor： Martin Kerber ,  Matthias Stecher

IPC: H01L29/40

CPC classification number: H01L29/402 ,  H01F27/2804 ,  H01L23/5227 ,  H01L23/585 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2924/00

Abstract: One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature.

Abstract translation: 一个或多个实施例涉及半导体结构，包括：导电特征; 外护环; 以及在所述外保护环和所述导电特征之间的内保护环，所述内保护环电耦合到所述导电特征。

公开(公告)号：US09048019B2

公开(公告)日：2015-06-02

申请号：US13625889

申请日：2012-09-25

Applicant: Infineon Technologies AG

Inventor： Martin Kerber ,  Matthias Stecher

IPC: H01L21/02 ,  H01F27/28 ,  H01L23/522 ,  H01L23/58 ,  H01L23/00

CPC classification number: H01L29/402 ,  H01F27/2804 ,  H01L23/5227 ,  H01L23/585 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2924/00

Abstract: One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature.

Abstract translation: 一个或多个实施例涉及半导体结构，包括：导电特征; 外护环; 以及在所述外保护环和所述导电特征之间的内保护环，所述内保护环电耦合到所述导电特征。

公开(公告)号：US09466677B2

公开(公告)日：2016-10-11

申请号：US14700203

申请日：2015-04-30

Applicant: Infineon Technologies AG

Inventor： Martin Kerber ,  Matthias Stecher

IPC: H01L29/40 ,  H01L23/58 ,  H01L23/522 ,  H01F27/28 ,  H01L23/00

CPC classification number: H01L29/402 ,  H01F27/2804 ,  H01L23/5227 ,  H01L23/585 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2924/00

Abstract: One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature.

公开(公告)号：US20130075861A1

公开(公告)日：2013-03-28

申请号：US13625889

申请日：2012-09-25

Applicant: Infineon Technologies AG

Inventor： Martin Kerber ,  Matthias Stecher

IPC: H01L27/06

CPC classification number: H01L29/402 ,  H01F27/2804 ,  H01L23/5227 ,  H01L23/585 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2924/00

Abstract: One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature.