公开(公告)号：US10658555B2

公开(公告)日：2020-05-19

申请号：US16140159

申请日：2018-09-24

Applicant: HOYA CANDEO OPTRONICS CORPORATION

Inventor： Yasuo Kogure ,  Shinichi Ogawa ,  Satoshi Yajima

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62 ,  H01L33/54

Abstract: Provided is an optical semiconductor apparatus including an optical semiconductor device; a light-permeable buffer layer that contains a cured high-hardness silicone resin, that has a thickness ranging from 1 μm to 300 μm, and that covers at least part of a light-emitting surface of the optical semiconductor device; and a flexible sealing layer containing a cured flexible silicone resin that has a lower hardness than the light-permeable buffer layer, and that covers the optical semiconductor device and the light-permeable buffer layer. The optical semiconductor apparatus has superior heat resistance and UV resistance and is significantly prevents the breakage of a wire electrically connected to the optical semiconductor device.

公开(公告)号：US09840592B2

公开(公告)日：2017-12-12

申请号：US15073713

申请日：2016-03-18

Applicant: HOYA CANDEO OPTRONICS CORPORATION

Inventor： Shinichi Ogawa

IPC: C08G77/04 ,  C08G77/08 ,  H01L33/56 ,  C08G77/18 ,  C08K5/057 ,  C08K3/32

CPC classification number: C08G77/04 ,  C08G77/08 ,  C08G77/18 ,  C08K5/057 ,  C08K2003/329 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A curable resin composition having high transparency in the UV region, UV resistance and heat resistance. The curable resin composition includes an alkoxy oligomer represented by Formula 1 of (R1R2R3SiO1/2)w(R4R5SiO2/2)x(R6SiO3/2)y(SiO4/2)z and a curing catalyst. The curing catalyst is phosphoric acid present in an amount of 3-30 parts by weight based on 100 parts by weight of the alkoxy oligomer, or alkoxide of at least one metal selected from the group consisting of B, Al, P, Sc, Ga, Y, Zr, Nb, In, Sn, La, Gd, Dy, Yb, Hf, Ta and W, present in an amount of 0.5-20 parts by weight based on 100 parts by weight of the alkoxy oligomer. Each of R1, R2, R3, R4, R5 and R6 independently represents the same or a different organic group, w, x, y and z are 0 or positive numbers satisfying the relationship of w+x+y+z=1, and the atomic ratio of O/Si is 2.3-3.5.

公开(公告)号：US10988624B2

公开(公告)日：2021-04-27

申请号：US15280196

申请日：2016-09-29

Applicant: HOYA CANDEO OPTRONICS CORPORATION

Inventor： Shinichi Ogawa

IPC: G02B5/08 ,  G02B5/20 ,  F21V9/04 ,  F21V9/06 ,  C09D7/61 ,  C09D1/00 ,  C09D7/00

Abstract: An ultraviolet absorbing film, a light absorbing film, an optical element, an optical unit, and a light illuminating apparatus are disclosed. The ultraviolet absorbing film is provided on at least one surface of an optical element to reduce internal reflections therein and includes a transition metal oxide of a transition metal selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ce, and combinations thereof that contains no organic constituent. The ultraviolet absorbing film is formed by a process including applying an ultraviolet absorbing paint including an oxide precursor of the transition metal on at least one surface of the optical element; and a binder component or a solvent in which the oxide precursor is dissolved; and heating the coating to a predetermined temperature at which the oxide precursor forms the transition metal oxide and the binder or the solvent substantially completely decomposes or volatilizes.

公开(公告)号：US09741911B2

公开(公告)日：2017-08-22

申请号：US15183247

申请日：2016-06-15

Applicant: HOYA CANDEO OPTRONICS CORPORATION

Inventor： Shinichi Ogawa

IPC: C09D183/04 ,  H01L33/56 ,  H01L33/32

CPC classification number: H01L33/56 ,  C08G77/28 ,  C09D183/04 ,  C09D183/08 ,  H01L33/32 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Disclosed is a curable resin composition that has significantly high transparency in the UV region, UV resistance and heat resistance, does not cause cracking, peeling or coloration even when used for sealing a UV LED to which high power is applied, and inhibits shrinking during curing. The curable resin composition includes 20-85 wt % of an alkoxy oligomer having a specific structure and present as liquid at room temperature and 15-80 wt % of a silicone resin present as solid at room temperature. The curable resin composition preferably includes 0.1-20 parts by weight of phosphoric acid, as a catalyst, based on 100 parts by weight of the combined weight of the alkoxy oligomer and the silicone resin.