公开(公告)号：US20140026923A1

公开(公告)日：2014-01-30

申请号：US13953677

申请日：2013-07-29

Applicant: Fontana Technology

Inventor： Mark Jonathan Beck

IPC: H01L21/02

CPC classification number: H01L21/02057 ,  C07C211/63 ,  C08F20/06 ,  C08F26/00 ,  C11D3/3723 ,  C11D3/3765 ,  C11D7/06 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3227 ,  C11D11/0047

Abstract: A cleaning solution and method for removing submicron particles from the surface of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer, a base and water. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of the polycarboxylate polymer. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.

Abstract translation: 一种清洁溶液和从半导体晶片等电子基板的表面除去亚微米颗粒的方法。 清洁溶液包含聚羧酸酯聚合物，碱和水。 该方法包括使基材的表面与由聚羧酸酯聚合物组成的清洁溶液接触的步骤。 该方法中的额外的可选步骤包括将声能施加到清洁溶液和/或用具有或不具有向冲洗溶液施加声能的冲洗溶液冲洗表面。

公开(公告)号：USRE46454E1

公开(公告)日：2017-06-27

申请号：US14986590

申请日：2015-12-31

Applicant: Fontana Technology

Inventor： Mark Jonathan Beck

IPC: C23G1/00 ,  C11D7/00 ,  B08B3/00 ,  C11D3/06 ,  H01L21/02 ,  C11D7/16 ,  C11D11/00 ,  B08B3/04 ,  H01L21/67 ,  G03F1/82

CPC classification number: B08B3/04 ,  C11D3/06 ,  C11D7/16 ,  C11D11/0047 ,  C11D11/007 ,  G03F1/82 ,  H01L21/02057 ,  H01L21/02087 ,  H01L21/67051

Abstract: A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.

公开(公告)号：US20130112228A1

公开(公告)日：2013-05-09

申请号：US13726521

申请日：2012-12-24

Applicant: Fontana Technology

Inventor： Mark Jonathan Beck

IPC: B08B3/04

CPC classification number: B08B3/04 ,  C11D3/06 ,  C11D7/16 ,  C11D11/0047 ,  C11D11/007 ,  G03F1/82 ,  H01L21/02057 ,  H01L21/02087 ,  H01L21/67051

Abstract: A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.

Abstract translation: 一种用于清洁诸如半导体晶片，硬盘，光掩模或压印模具的电子基板的方法和清洁方法。 该方法包括以下步骤：使基材的表面与由多磷酸盐组成的清洁溶液接触，然后从表面除去清洁溶液。 附加的可选步骤包括在清洁溶液与表面接触的同时将清洁溶液施加声能，并且通过在施加或不施加声能的情况下用冲洗溶液冲洗表面从表面除去清洁溶液。 清洁溶液包含多磷酸盐，例如任何水溶性聚磷酸盐。 取决于应用，清洁溶液还可以包含碱和/或一定量的悬浮颗粒。 络合剂，胺，杀生物剂，表面活性剂和/或其它物质也可以加入到清洁溶液中。

公开(公告)号：US09275850B2

公开(公告)日：2016-03-01

申请号：US13953677

申请日：2013-07-29

Applicant: Fontana Technology

Inventor： Mark Jonathan Beck

IPC: B08B3/14 ,  H01L21/02 ,  C07C211/63 ,  C08F20/06 ,  C08F26/00 ,  C11D3/37 ,  C11D7/06 ,  C11D7/26 ,  C11D7/32 ,  C11D11/00

CPC classification number: H01L21/02057 ,  C07C211/63 ,  C08F20/06 ,  C08F26/00 ,  C11D3/3723 ,  C11D3/3765 ,  C11D7/06 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3227 ,  C11D11/0047

Abstract: A cleaning solution and method for removing submicron particles from the surface of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer, a base and water. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of the polycarboxylate polymer. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.

Abstract translation: 一种清洁溶液和从半导体晶片等电子基板的表面除去亚微米颗粒的方法。 清洁溶液包含聚羧酸酯聚合物，碱和水。 该方法包括使基材的表面与由聚羧酸酯聚合物组成的清洁溶液接触的步骤。 该方法中的额外的可选步骤包括将声能施加到清洁溶液和/或用具有或不具有向冲洗溶液施加声能的冲洗溶液冲洗表面。

公开(公告)号：US08764906B2

公开(公告)日：2014-07-01

申请号：US13726521

申请日：2012-12-24

Applicant: Fontana Technology

Inventor： Mark Jonathan Beck

IPC: C23G1/00 ,  C11D7/00 ,  B08B3/00

CPC classification number: B08B3/04 ,  C11D3/06 ,  C11D7/16 ,  C11D11/0047 ,  C11D11/007 ,  G03F1/82 ,  H01L21/02057 ,  H01L21/02087 ,  H01L21/67051

Abstract: A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.

Abstract translation: 一种用于清洁诸如半导体晶片，硬盘，光掩模或压印模具的电子基板的方法和清洁方法。 该方法包括以下步骤：使基材的表面与由多磷酸盐组成的清洁溶液接触，然后从表面除去清洁溶液。 附加的可选步骤包括在清洁溶液与表面接触的同时将清洁溶液施加声能，并且通过在施加或不施加声能的情况下用冲洗溶液冲洗表面从表面除去清洁溶液。 清洁溶液包含多磷酸盐，例如任何水溶性聚磷酸盐。 取决于应用，清洁溶液还可以包含碱和/或一定量的悬浮颗粒。 络合剂，胺，杀生物剂，表面活性剂和/或其它物质也可以加入到清洁溶液中。