公开(公告)号：US20240040703A1

公开(公告)日：2024-02-01

申请号：US18231043

申请日：2023-08-07

Applicant: FLEX LTD

Inventor： Dongkai Shangguan ,  David Geiger ,  Venkat Iyer ,  Cheng Yang

IPC: H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0044 ,  H05K3/0026 ,  H05K3/284 ,  H05K2203/025

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

公开(公告)号：US11723151B2

公开(公告)日：2023-08-08

申请号：US17719348

申请日：2022-04-12

Applicant: FLEX LTD

Inventor： Dongkai Shangguan ,  David Geiger ,  Venkat Iyer ,  Cheng Yang

IPC: H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0044 ,  H05K3/0026 ,  H05K3/284 ,  H05K2203/025

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

公开(公告)号：US20220238482A1

公开(公告)日：2022-07-28

申请号：US17668921

申请日：2022-02-10

Applicant: FLEX LTD

Inventor： Cheng Yang ,  Dongkai Shangguan ,  Li Yao

IPC: H01L23/00 ,  H05K1/02 ,  H01L23/367

Abstract: An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

公开(公告)号：US11682603B2

公开(公告)日：2023-06-20

申请号：US17212525

申请日：2021-03-25

Applicant: Flex Ltd.

Inventor： Cheng Yang ,  Dongkai Shangguan

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/66 ,  H01L21/48 ,  B23K1/00 ,  H01L25/065

CPC classification number: H01L23/373 ,  B23K1/0008 ,  H01L21/4882 ,  H01L22/12 ,  H01L23/367 ,  H01L25/0655 ,  H01L23/3675 ,  H01L23/3737

Abstract: An electronic system includes a plurality of heat sources. At least two of the plurality of heat sources vary in height and each of the plurality of heat sources includes a first side and a second side. The electronic system also includes a substrate having a first side and a second side. The second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate. The electronic system further includes a cover member provided above the plurality of heat sources and a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height.

公开(公告)号：US20210125958A1

公开(公告)日：2021-04-29

申请号：US16709750

申请日：2019-12-10

Applicant: FLEX LTD

Inventor： Cheng Yang ,  Dongkai Shangguan ,  Li Yao

IPC: H01L23/00 ,  H01L23/367 ,  H05K1/02

Abstract: An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

公开(公告)号：US20210100106A1

公开(公告)日：2021-04-01

申请号：US16709743

申请日：2019-12-10

Applicant: FLEX LTD

Inventor： Dongkai Shangguan ,  David Geiger ,  Venkat Iyer ,  Cheng Yang

IPC: H05K3/00 ,  H05K3/28

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

公开(公告)号：US11270974B2

公开(公告)日：2022-03-08

申请号：US16709750

申请日：2019-12-10

Applicant: FLEX LTD

Inventor： Cheng Yang ,  Dongkai Shangguan ,  Li Yao

IPC: H01L21/50 ,  H01L23/00 ,  H05K1/02 ,  H01L23/367

Abstract: An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

公开(公告)号：US10896877B1

公开(公告)日：2021-01-19

申请号：US16221256

申请日：2018-12-14

Applicant: Flex Ltd.

Inventor： Cheng Yang ,  Dongkai Shangguan ,  Bo Li ,  Venkat Iyer

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/522 ,  H01L23/532 ,  H01L23/31

Abstract: An improved SiP structure includes one or more interposers positioned to form a center cavity into which one or more electronic components can be mounted. The improved SiP structure provides a reduced footprint using the one or more interposers and formed center cavity without the need of laser drilling, exposed molding, and/or double side molding.

公开(公告)号：US12243850B2

公开(公告)日：2025-03-04

申请号：US17392995

申请日：2021-08-03

Applicant: Flex Ltd.

Inventor： Cheng Yang ,  Dongkai Shangguan

IPC: H01L25/065 ,  H01L23/00

Abstract: A package includes a first chip stack. The first chip stack includes a first chip including first bonding structures, a second chip including second bonding structures facing the first bonding structures and bonded to the first bonding structures, and a first electrical contact on the second chip. At least a portion of the first electrical contact does not overlap with the first chip in a plan view.

公开(公告)号：US11304302B2

公开(公告)日：2022-04-12

申请号：US16709743

申请日：2019-12-10

Applicant: FLEX LTD

Inventor： Dongkai Shangguan ,  David Geiger ,  Venkat Iyer ,  Cheng Yang

IPC: H05K3/00 ,  H05K3/28

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.