公开(公告)号：US10056319B2

公开(公告)日：2018-08-21

申请号：US15484714

申请日：2017-04-11

Applicant: Delta Electronics, Inc.

Inventor： Chia-Yen Lee ,  Hsin-Chang Tsai ,  Peng-Hsin Lee ,  Shiau-Shi Lin ,  Tzu-Hsuan Cheng

IPC: H01L23/495 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

Abstract: A packaging structure is provided, including a substrate, a first chip, a second chip, and a conductive unit. The substrate includes a metal carrier, a patterned insulation layer disposed on the metal carrier and partially covering the metal carrier, and a patterned conductive layer disposed on the patterned insulation layer. The first chip is disposed on the metal carrier not covered by the patterned insulation layer. The second chip is disposed on the patterned conductive layer and electrically connected to the first chip by the conductive unit.

公开(公告)号：US10741644B2

公开(公告)日：2020-08-11

申请号：US15358469

申请日：2016-11-22

Applicant: Delta Electronics, Inc.

Inventor： Shiau-Shi Lin ,  Tzu-Hsuan Cheng ,  Hsin-Chang Tsai

IPC: H01L29/08 ,  H01L23/522 ,  H01L29/66 ,  H01L23/367 ,  H01L23/31

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.