公开(公告)号：US09640297B2

公开(公告)日：2017-05-02

申请号：US14356653

申请日：2012-12-19

Applicant: Cytec Technology Corp.

Inventor： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

IPC: H01B1/06 ,  H01B1/24 ,  H01B1/22 ,  C08K3/04 ,  C08K7/24

CPC classification number: H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/0079 ,  Y10S977/753 ,  Y10S977/847 ,  Y10S977/932

Abstract: A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

公开(公告)号：US20170301428A1

公开(公告)日：2017-10-19

申请号：US15471160

申请日：2017-03-28

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

IPC: H01B1/22 ,  H01Q17/00 ,  H05K9/00 ,  C08L63/00 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/0079 ,  Y10S977/753 ,  Y10S977/847 ,  Y10S977/932

Abstract: A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

公开(公告)号：US20140306164A1

公开(公告)日：2014-10-16

申请号：US14356653

申请日：2012-12-19

Applicant: Cytec Technology Corp.

Inventor： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

IPC: H01B1/22

CPC classification number: H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/0079 ,  Y10S977/753 ,  Y10S977/847 ,  Y10S977/932

Abstract: A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

Abstract translation: 一种制备包含一种或多种导电纳米填料，一种或多种聚芳醚砜热塑性聚合物（A），一种或多种未固化的热固性树脂前体（P）和任选的一种或多种 或更多的固化剂，其中所述方法包括将包含一种或多种导电纳米填料和一种或多种聚芳醚砜热塑性聚合物（A）的第一组合物混合或分散在一种或多种未固化的 热固性树脂前体（P）和任选的一种或多种固化剂。

公开(公告)号：US10236092B2

公开(公告)日：2019-03-19

申请号：US15471160

申请日：2017-03-28

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

IPC: H01B1/22 ,  C08K3/04 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/00 ,  B82Y30/00 ,  B82Y40/00

Abstract: A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.