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公开(公告)号：US20240047844A1
公开(公告)日：2024-02-08
申请号：US18333655
申请日：2023-06-13
Applicant: CommScope Technologies LLC
Inventor： Kamalakar Yeddula , NBVS Krishna , Rakesh Kalwani , Kumara Swamy Kasani
CPC classification number: H01P5/16 , H01Q9/16 , H01P3/08 , H05K1/0237
Abstract: A hybrid coupler is disclosed. The hybrid coupler comprises a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer. The first metallization layer comprises at least two input ports and at least two output ports. The hybrid coupler further comprises a plurality of couplers coupled adjacent to each other on the first metallization layer. Each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer. The hybrid coupler furthermore comprises a defective ground structure having a pre-defined shape defined in the second metallization layer below each coupling junction formed between the transmission traces of the plurality of couplers.
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Patent Agency Ranking
2.发明公开公开(公告)号：US20240072438A1
公开(公告)日：2024-02-29
申请号：US18451177
申请日：2023-08-17
Applicant: CommScope Technologies LLC
Inventor： Xiangyang Ai , Chengcheng Tang , Martin L. Zimmerman , Kamalakar Yeddula , Kumara Swamy Kasani , Sharal Dhanapal
Abstract: Antennas are provided. An antenna includes an antenna array having a plurality of sub-arrays that each include a plurality of radiating elements. Moreover, the antenna includes a multi-stage beamforming network having a first stage including a plurality of first Butler matrices and a second stage including a plurality of second Butler matrices that are coupled between the first Butler matrices and the sub-arrays. The first Butler matrices are each coupled to each of the second Butler matrices. The second Butler matrices are coupled to the sub-arrays, respectively, without any cables between the second Butler matrices and the sub-arrays.
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公开(公告)号：US20230299469A1
公开(公告)日：2023-09-21
申请号：US18162757
申请日：2023-02-01
Applicant: CommScope Technologies LLC
Inventor： Kumara Swamy Kasani , Ligang Wu , Faisalbin Abdulmajeed N , Kamalakar Yeddula
Abstract: Base station antennas are provided. A base station antenna includes a first array of radiating elements and a second array of radiating elements that is interleaved with the first array. Each of the first and second arrays has a plurality of non-rectangular sub-arrays that include radiating elements in one or more outer columns and radiating elements in an inner column that is between the first and second outer columns.
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公开(公告)号：US20240322415A1
公开(公告)日：2024-09-26
申请号：US18672519
申请日：2024-05-23
Applicant: CommScope Technologies LLC
Inventor： Kamalakar Yeddula , NBVS Krishna , Rakesh Kalwani , Kumara Swamy Kasani
CPC classification number: H01P5/16 , H01P3/08 , H01Q9/16 , H05K1/0237
Abstract: A hybrid coupler is disclosed. The hybrid coupler includes a printed circuit board. The printed circuit board includes at least two input ports, at least two output ports, and a plurality of couplers, each coupler of the plurality of couplers comprising first and second transmission traces and a coupling junction connecting the first and second transmission traces. The plurality of couplers are electrically coupled in series between the input ports and the output ports. The hybrid coupler further includes a defective ground structure below the coupling junction of at least one of the plurality of couplers.
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公开(公告)号：US12027745B2
公开(公告)日：2024-07-02
申请号：US18333655
申请日：2023-06-13
Applicant: CommScope Technologies LLC
Inventor： Kamalakar Yeddula , NBVS Krishna , Rakesh Kalwani , Kumara Swamy Kasani
CPC classification number: H01P5/16 , H01P3/08 , H01Q9/16 , H05K1/0237
Abstract: A hybrid coupler is disclosed. The hybrid coupler comprises a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer. The first metallization layer comprises at least two input ports and at least two output ports. The hybrid coupler further comprises a plurality of couplers coupled adjacent to each other on the first metallization layer. Each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer. The hybrid coupler furthermore comprises a defective ground structure having a pre-defined shape defined in the second metallization layer below each coupling junction formed between the transmission traces of the plurality of couplers.
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公开(公告)号：US20240063539A1
公开(公告)日：2024-02-22
申请号：US18366785
申请日：2023-08-08
Applicant: CommScope Technologies LLC
Inventor： Jitendra Thakur , Kumara Swamy Kasani , Kamalakar Yeddula
IPC: H01Q3/32
CPC classification number: H01Q3/32
Abstract: A phase shifter, which may include an input port configured to receive a radio frequency (RF) signal. The phase shifter may include a first conductive trace that is electrically connected to a first output port. The first output port may be configured to output a first phase-shifted sub-component of the RF signal. The phase shifter may include a wiper configured to couple the input port to the first conductive trace. The wiper may include a first conductive pad adapted to slide on the first conductive trace. The first conductive trace may include a first metal trace that has a plurality of slits formed therein where the metal is omitted. Each slit may include an enlarged portion formed along a length thereof. The enlarged portion of at least some of the slits may be formed at a tip end of the slit and/or at a middle of the length of the slit.
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