公开(公告)号：US07655540B2

公开(公告)日：2010-02-02

申请号：US12076674

申请日：2008-03-21

Applicant: Cho-Hsin Chang

Inventor： Cho-Hsin Chang

IPC: H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC classification number: H01L21/6838 ,  H01L21/67333 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68313 ,  H01L2224/48 ,  H01L2225/06562 ,  H01L2924/00014 ,  Y10T29/53174 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and jig structure for positioning bare dice is disclosed. The jig structure for positioning at least one bare dice includes a trap having at least one positioning groove wherein the depth of the positioning groove is less than the height of the bare dice. Basing on the positioning groove formed in the tray, once a bare dice is placed in the positioning groove, the partially exposed bare dice can be located directly and precisely vacuum-grabbed by a sucker, so that the number of positioning steps is reduced.

Abstract translation: 公开了一种用于定位裸裸片的方法和夹具结构。 用于定位至少一个裸裸片的夹具结构包括具有至少一个定位凹槽的陷阱，其中定位凹槽的深度小于裸芯片的高度。 基于形成在托盘中的定位槽，一旦将裸头放置在定位槽中，部分露出的裸骰子可以由吸盘直接且精确地被真空吸取，从而减少了定位步骤的数量。

公开(公告)号：US20090239317A1

公开(公告)日：2009-09-24

申请号：US12076674

申请日：2008-03-21

Applicant: Cho-Hsin Chang

Inventor： Cho-Hsin Chang

IPC: H01L21/48 ,  H01L21/60 ,  H05K13/04

CPC classification number: H01L21/6838 ,  H01L21/67333 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68313 ,  H01L2224/48 ,  H01L2225/06562 ,  H01L2924/00014 ,  Y10T29/53174 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and jig structure for positioning bare dice is disclosed. The jig structure for positioning at least one bare dice includes a trap having at least one positioning groove wherein the depth of the positioning groove is less than the height of the bare dice. Basing on the positioning groove formed in the tray, once a bare dice is placed in the positioning groove, the partially exposed bare dice can be located directly and precisely vacuum-grabbed by a sucker, so that the number of positioning steps is reduced.

Abstract translation: 公开了一种用于定位裸裸片的方法和夹具结构。 用于定位至少一个裸裸片的夹具结构包括具有至少一个定位凹槽的陷阱，其中定位凹槽的深度小于裸芯片的高度。 基于形成在托盘中的定位槽，一旦将裸头放置在定位槽中，部分露出的裸骰子可以由吸盘直接且精确地被真空吸取，从而减少了定位步骤的数量。

公开(公告)号：US20120235259A1

公开(公告)日：2012-09-20

申请号：US13242182

申请日：2011-09-23

Applicant: Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai

Inventor： Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and a method of fabricating the same. The semiconductor package includes: a substrate having a plurality of semiconductor components disposed thereon; an encapsulant covering the substrate and the semiconductor components; and a metal layer formed on the exposed surfaces of the encapsulant, wherein the encapsulant is formed with a trench for dividing into a plurality of package units on the substrate to allow each of the package units to have at least one of the semiconductor components, and the metal layer is formed in the trench to encompass the encapsulant on the periphery of the semiconductor components, thereby preventing interference of electromagnetic waves between the semiconductor components.

Abstract translation: 一种半导体封装及其制造方法。 半导体封装包括：具有设置在其上的多个半导体部件的衬底; 覆盖基板和半导体部件的密封剂; 以及形成在所述密封剂的暴露表面上的金属层，其中所述密封剂形成有用于在所述基板上分成多个封装单元的沟槽，以允许每个所述封装单元具有所述半导体部件中的至少一个，以及 金属层形成在沟槽中以包围半导体部件的周边上的密封剂，从而防止电磁波在半导体部件之间的干扰。