公开(公告)号：US20190296064A1

公开(公告)日：2019-09-26

申请号：US16301726

申请日：2017-05-18

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu ,  Wenbin Wang

IPC: H01L27/146 ,  H01L23/00

Abstract: Provided are a packaging method and packaging structure for a semiconductor chip. The packaging method comprises: providing a wafer, the wafer being provided with multiple semiconductor chips, each semiconductor chip being provided with a functional area and solder pads arranged on a first surface; providing a protective substrate, multiple support units being provided on the protective substrate, openings being formed on the support units; aligning the solder pads to the openings and facing support units provided on the protective substrate to the first surface of the wafer, and pressing together the wafer and the protective substrate. The packaging method effectively prevents the support units from generating stress that acts on the solder pads in a subsequent reliability test, thus preventing cases of the solder pad being damaged or split into layers.

公开(公告)号：US20190188447A1

公开(公告)日：2019-06-20

申请号：US16210989

申请日：2018-12-05

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu

IPC: G06K9/00 ,  H01L27/146

Abstract: An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

公开(公告)号：US10541186B2

公开(公告)日：2020-01-21

申请号：US15950302

申请日：2018-04-11

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu

IPC: H01L23/00 ,  H01L23/31 ,  H01L27/146 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L21/768

Abstract: A chip package and a chip packaging method are provided. The package includes: a chip to be packaged, a reinforcing layer and solder bumps. The chip to be packaged includes a first surface and a second surface opposite to each other, the first surface includes a sensing region and first contact pads, and the first contact pads are electrically coupled to the sensing region. The reinforcing layer covers the first surface of the chip to be packaged. The solder bumps are provided on the second surface of the chip to be packaged. The solder bump is electrically connected to the first contact pad and is configured to electrically connect with an external circuit.

公开(公告)号：US20180366387A1

公开(公告)日：2018-12-20

申请号：US15950302

申请日：2018-04-11

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu

IPC: H01L23/31 ,  H01L23/00 ,  H01L27/146 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L21/768

Abstract: A chip package and a chip packaging method are provided. The package includes: a chip to be packaged, a reinforcing layer and solder bumps. The chip to be packaged includes a first surface and a second surface opposite to each other, the first surface includes a sensing region and first contact pads, and the first contact pads are electrically coupled to the sensing region. The reinforcing layer covers the first surface of the chip to be packaged. The solder bumps are provided on the second surface of the chip to be packaged. The solder bump is electrically connected to the first contact pad and is configured to electrically connect with an external circuit.

公开(公告)号：US10817700B2

公开(公告)日：2020-10-27

申请号：US16210989

申请日：2018-12-05

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu

IPC: G06K9/00 ,  H01L27/146

Abstract: An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

公开(公告)号：US20200234028A9

公开(公告)日：2020-07-23

申请号：US16210989

申请日：2018-12-05

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu

IPC: G06K9/00 ,  H01L27/146

Abstract: An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

公开(公告)号：US20190013302A1

公开(公告)日：2019-01-10

申请号：US16028545

申请日：2018-07-06

Applicant: China Wafer Level CSP Co., Ltd.

Inventor： Zhiqi Wang ,  Guoliang Xie ,  Hanqing Hu

IPC: H01L25/16 ,  H01L25/00 ,  H01L21/78 ,  H01L23/00 ,  H01L21/768 ,  H01L21/683 ,  H01L23/528 ,  H01L23/522 ,  G06K9/00

Abstract: A packaging method and a package structure for a fingerprint recognition chip and a drive chip are provided. The packaging method is a wafer-level packaging method. According to the method, a blind hole is formed on the back surface of a wafer and the drive chip is secured in the blind hole, then the wafer is cut to obtain a package structure for the fingerprint recognition chip and the drive chip. In this way, the drive chip is packaged in the back surface of the wafer-level fingerprint recognition chip, thereby reducing the complexity of the package process. In addition, the size of the package structure is close to the size of the single fingerprint recognition chip, thereby greatly reducing the size of the package structure and improving the integration of the package structure.