公开(公告)号：US20220102895A1

公开(公告)日：2022-03-31

申请号：US17037469

申请日：2020-09-29

Applicant: Chia-Hsin Wang

Inventor： Kuo-Chi Yu

IPC: H01R13/20 ,  H01R13/11 ,  H01R13/627

Abstract: A method of manufacturing and assembling an embedded terminal module, comprising the steps of: (A) placing a terminal component in a mold; (B) a mating component partially over the terminal component to form a mating terminal component; (C) assembling at least two mating terminal component in a mirror-aligned manner to a mating socket to form the embedded terminal module.

公开(公告)号：US12034242B2

公开(公告)日：2024-07-09

申请号：US17037469

申请日：2020-09-29

Applicant: Chia-Hsin Wang

Inventor： Kuo-Chi Yu

IPC: B29C70/72 ,  H01R13/11 ,  H01R13/20 ,  H01R13/627 ,  H01R13/05

CPC classification number: H01R13/20 ,  B29C70/72 ,  H01R13/113 ,  H01R13/6273 ,  H01R13/055

Abstract: A method of manufacturing and assembling an embedded terminal module, comprising the steps of: (A) placing a terminal component in a mold; (B) a mating component partially over the terminal component to form a mating terminal component; (C) assembling at least two mating terminal component in a mirror-aligned manner to a mating socket to form the embedded terminal module.