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公开(公告)号：US11532913B2
公开(公告)日：2022-12-20
申请号：US16372439
申请日：2019-04-02
Applicant: BizLink International Corp.
Inventor： Hsin-Tuan Hsiao , Kuo-Yang Tsai
IPC: H01R13/6474 , H01R13/02 , H01R9/03 , H01R12/62 , H01B11/00 , H05K1/02 , H01R12/77 , H01R12/72 , H01R13/502
Abstract: A cable assembly includes a plurality of wires and a plurality of electrical contacts. The electrical contacts include contact sections and wire connecting sections, and the wire connecting sections of the electrical contacts are respectively connected to the wires. Two adjacent electrical contacts for transmitting signals have a first edge distance and an expanded edge distance. The first edge distance is adjacent to the contact sections, and the expanded edge distance is between the first edge distance and the wire connecting sections. In addition, the first edge distance is smaller than the expanded edge distance to improve signal integrity.
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公开(公告)号：US10658795B2
公开(公告)日：2020-05-19
申请号：US16372428
申请日：2019-04-02
Applicant: BizLink International Corp.
Inventor： Hsin-Tuan Hsiao , Kuo-Yang Tsai
IPC: H01R13/646 , H01R13/502 , H01R12/71
Abstract: A cable assembly includes a plurality of wires and a plurality of electrical contacts. The electrical contacts include contact sections and wire connection sections, and the wire connection sections of the electrical contacts are respectively connected to the wires. Two adjacent electrical contacts for transmitting signals have a first center distance and a reduced center distance. The first center distance is adjacent to the contact sections, and the reduced center distance is between the first center distance and the wire connecting sections. In addition, the first center distance is greater than the reduced center distance to improve signal integrity.
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公开(公告)号：US10530078B1
公开(公告)日：2020-01-07
申请号：US16249879
申请日：2019-01-16
Applicant: BizLink International Corp.
Inventor： Hsin-Tuan Hsiao , Kuo-Yang Tsai
Abstract: An electronic signal processing device includes a printed circuit board, a signal processing chip, a plurality of conductive lines, a plurality of copper pads, and a fixing device. The signal processing chip is mounted on the printed circuit board, and a plurality of conductive lines are formed on the printed circuit board and connected to the signal processing chip. The copper pads are respectively formed at the ends of the conductive lines. The fixing device is fixed on the printed circuit board and exposes the copper pads to connect to a cable assembly so as to improve signal integrity.
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