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    Chip-to-Chip Optical Data Communication System
    3.
    发明公开
    Chip-to-Chip Optical Data Communication System 审中-公开

    公开(公告)号：US20240310589A1

    公开(公告)日：2024-09-19

    申请号：US18675112

    申请日：2024-05-27

    Applicant: Ayar Labs, Inc.

    Inventor： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

    IPC: G02B6/42 ,  G02B6/293

    CPC classification number: G02B6/4202 ,  G02B6/2934 ,  G02B6/4216 ,  G02B6/4219 ,  G02B6/4287

    Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

    Laser Module for Optical Data Communication System within Silicon Interposer
    4.
    发明申请
    Laser Module for Optical Data Communication System within Silicon Interposer 有权

    公开(公告)号：US20220360336A1

    公开(公告)日：2022-11-10

    申请号：US17866482

    申请日：2022-07-16

    Applicant: Ayar Labs, Inc.

    Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden ,  Michael Davenport

    IPC: H04B10/50 ,  H01S5/40 ,  H01S5/026 ,  H04B10/80 ,  H01S5/02325

    Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

    Chip-to-chip optical data communication system
    5.
    发明授权
    Chip-to-chip optical data communication system 有权

    公开(公告)号：US11249260B2

    公开(公告)日：2022-02-15

    申请号：US16937428

    申请日：2020-07-23

    Applicant: Ayar Labs, Inc.

    Inventor： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/293

    Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

    Laser Module for Optical Data Communication System
    10.
    发明申请
    Laser Module for Optical Data Communication System 有权

    公开(公告)号：US20220407606A1

    公开(公告)日：2022-12-22

    申请号：US17893114

    申请日：2022-08-22

    Applicant: Ayar Labs, Inc.

    Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden

    IPC: H04B10/50 ,  H01S5/40 ,  H01S5/026 ,  H04J14/02 ,  H01S5/02325

    Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.

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