公开(公告)号：US09439312B2

公开(公告)日：2016-09-06

申请号：US14490226

申请日：2014-09-18

Applicant: Artesyn Embedded Computing, Inc.

Inventor： Martin Peter John Cornes ,  Suzanne Marye Wong ,  Ross L. Armstrong ,  Douglas L. Sandy

IPC: H05K5/00 ,  H05K5/02

CPC classification number: H05K5/0247 ,  H05K5/0256 ,  H05K7/1432

Abstract: A canister system having a cylindrical housing, having at least one enclosed end, and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system including an input/output device extending along at least a portion of the modular electronic rack system. The modular electronic rack system further having a power input and a signal output electrically coupled to the input/output device—at least one of the power input and the signal output extending through the at least one enclosed end of the cylindrical housing at a first sealed terminal. The canister system further having a first alignment system for physically aligning an electronic connection with the sealed terminal. The electronic connection having physically engaging features extending from the cylindrical housing to align the electronic connection therewith.

Abstract translation: 具有圆柱形壳体的罐系统，其具有至少一个封闭端，以及设置在所述圆柱形壳体内的模块化电子机架系统。 模块化电子机架系统包括沿着模块化电子机架系统的至少一部分延伸的输入/输出装置。 所述模块化电子机架系统还具有电力输入和电耦合到所述输入/输出装置的信号输出 - 所述功率输入和所述信号输出中的至少一个在所述圆柱形壳体的至少一个封闭端处以第一密封 终奌站。 该罐系统还具有用于将电子连接与密封端子物理对准的第一对准系统。 电子连接件具有从圆柱形壳体延伸的具有物理接合特征以将电子连接对准。

公开(公告)号：US10327357B2

公开(公告)日：2019-06-18

申请号：US14490186

申请日：2014-09-18

Applicant: Artesyn Embedded Computing, Inc.

Inventor： Martin Peter John Cornes ,  Suzanne Marye Wong ,  Ross L. Armstrong ,  Douglas L. Sandy

IPC: H05K1/18 ,  H05K5/02 ,  H05K7/02 ,  H05K7/14 ,  H05K7/20 ,  F28F7/00 ,  H05K1/02 ,  G06F1/18 ,  G06F1/20

Abstract: A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.

公开(公告)号：US10039210B2

公开(公告)日：2018-07-31

申请号：US15616257

申请日：2017-06-07

Applicant: Artesyn Embedded Computing, Inc.

Inventor： Suzanne Marye Wong ,  Martin Peter John Cornes ,  Robert Charles Tufford

IPC: H05K7/20

CPC classification number: H05K7/20545

Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slidably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

公开(公告)号：US09414524B2

公开(公告)日：2016-08-09

申请号：US14023521

申请日：2013-09-11

Applicant: Artesyn Embedded Computing, Inc.

Inventor： George Paul Zemke ,  Suzanne Marye Wong

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

CPC classification number: H05K7/2039 ,  G06F1/206 ,  H05K7/1404

Abstract: A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet.

Abstract translation: 用于安装在机柜中的电路板组件包括具有安装在其上的PCB的第一标准尺寸的第一安装框架部分。 第二安装框架部分连接到第一安装框架部分，其中没有PCB的部分连接到其上。 第一和第二安装框架的组合尺寸限定了较大的基于第二标准的尺寸。 多个传热部件可以连接到第一或第二安装框架部分，从而提供传导/对流冷却路径。 第一安装框架部分可以包括第一假板边缘，并且第二安装框架部分包括一个或多个横向并相对定向于第一假板边缘的假板边缘。 第一和第二假板边缘可滑动地接收在机柜中形成的相对的槽中。

公开(公告)号：US09288929B1

公开(公告)日：2016-03-15

申请号：US14490169

申请日：2014-09-18

Applicant: Artesyn Embedded Computing, Inc.

Inventor： Suzanne Marye Wong ,  Ross L. Armstrong ,  Martin Peter John Cornes ,  Douglas L. Sandy

IPC: H05K5/00 ,  H05K7/14 ,  H05K5/06

CPC classification number: E21B41/0007 ,  E21B47/011

Abstract: A ruggedized canister system having a cylindrical housing and a modular electronic rack system disposed therein. The modular electronic rack system includes a backplane and a plurality of rib members radiating outwardly from the backplane. The rib members extend from the backplane at a proximal end in a direction generally orthogonal to the longitudinal axis of the backplane toward a distal end. An input/output device extends along at least a portion of the backplane and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots are positioned within a space define by the rib members when viewed in plan view. Each of the electronic slots is configured to physically and operably receive an electronic card. Each of the electronic slots is electrically connected to the input/output device for electrical communication between the electronic card and the input/output device.

Abstract translation: 一种坚固耐用的罐系统，其具有圆柱形壳体和设置在其中的模块化电子机架系统。 模块化电子机架系统包括背板和从背板向外辐射的多个肋构件。 肋构件在近端处从背板延伸到与背板的纵向轴线大致正交的方向朝向远端延伸。 输入/输出装置沿着背板的至少一部分延伸，并且包括电力输入和与其电耦合的信号输出。 当在俯视图中观察时，多个电子槽定位在由肋构件限定的空间内。 每个电子槽被配置为物理上和可操作地接收电子卡。 每个电子插槽电连接到输入/输出装置，用于电子卡和输入/输出装置之间的电气通信。