公开(公告)号：US11380625B2

公开(公告)日：2022-07-05

申请号：US17009601

申请日：2020-09-01

Applicant: Advanced Semiconductor Engineering Korea, Inc.

Inventor： Soonheung Bae ,  Jyhwan Lee ,  Jaeshin Cho

IPC: H01L21/268 ,  H01L23/552 ,  H01L25/065

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first device, a second device, and a shielding structure. The first device and the second device is one a first side of a substrate. The shielding structure includes a first portion and a second portion. The first portion is between the first device and the second device on the substrate, and the first portion includes a plurality of first shielding units arranged along a first direction. The second portion is between the first device and the second device, and the second portion includes a plurality of second shielding units arranged along a second direction different from the first direction. The second portion is configured as a first waveguide between the first device and the second device.