公开(公告)号：US11342476B2

公开(公告)日：2022-05-24

申请号：US16923876

申请日：2020-07-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen

IPC: H01L31/00 ,  H01L33/00 ,  H01L31/14 ,  H01L31/0216 ,  H01L33/52 ,  H01L31/18 ,  H01L33/44 ,  H01L31/0203

Abstract: An optical device includes a substrate, a light receiving component, an encapsulant, a coupling layer and a light shielding layer. The light receiving component is disposed on the substrate. The encapsulant covers the light receiving component. The coupling layer is disposed on at least a portion of the encapsulant. The light shielding layer is disposed on the coupling layer.

公开(公告)号：US11094858B2

公开(公告)日：2021-08-17

申请号：US16529569

申请日：2019-08-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen

IPC: H01L33/00 ,  H01L23/48 ,  H01L21/00 ,  H01L33/56 ,  H01L33/54 ,  H01L51/52 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/522 ,  H01L23/00 ,  G02B3/00 ,  H01S5/183

Abstract: A tape includes at least one tape unit. The tape unit includes a base structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion, and has a third surface opposite to the first surface of the first portion and a lateral surface extending between the second surface and the third surface. An area of the first portion from a top view is greater than an area of the second portion from a top view.

公开(公告)号：US12266618B2

公开(公告)日：2025-04-01

申请号：US17676086

申请日：2022-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen ,  Shyue-Long Louh

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/22 ,  H01L21/56 ,  H01L25/16 ,  H01Q1/38

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.

公开(公告)号：US12185047B2

公开(公告)日：2024-12-31

申请号：US17560179

申请日：2021-12-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Yi Wu ,  Hung Yi Lin ,  Jenchun Chen

IPC: H04R1/10

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.

公开(公告)号：US11996373B2

公开(公告)日：2024-05-28

申请号：US18109787

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen ,  An-Ping Chien

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/38

CPC classification number: H01L23/66 ,  H01L21/4846 ,  H01L23/49838 ,  H01L23/552 ,  H01Q1/38 ,  H01L2223/6677

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

公开(公告)号：US11581274B2

公开(公告)日：2023-02-14

申请号：US16907049

申请日：2020-06-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen ,  An-Ping Chien

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/38 ,  H01L23/552

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

公开(公告)号：US11476128B2

公开(公告)日：2022-10-18

申请号：US17002433

申请日：2020-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen ,  An-Ping Chien

IPC: B23K1/00 ,  H01L21/50 ,  H01L21/60

Abstract: The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

公开(公告)号：US10784230B2

公开(公告)日：2020-09-22

申请号：US15352527

申请日：2016-11-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen

IPC: H01L25/065 ,  H01L23/552 ,  H01L25/10 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a surface. The first component is on the surface of the substrate. The second component is on the surface of the substrate. The package body comprises a first portion, a second portion and a third portion. The first portion encapsulates the first component and has a side surface. The second portion encapsulates the second component and has a side surface. The third portion connects the first portion and the second portion and has a top surface. The side surface of the first portion, the side surface of the second portion and the top surface of the third portion define a space separating the side surface of the first portion from the side surface of the second portion. The conductive material is disposed in the space.

公开(公告)号：US10734540B1

公开(公告)日：2020-08-04

申请号：US16503321

申请日：2019-07-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen

IPC: H01L31/00 ,  H01L33/00 ,  H01L31/14 ,  H01L31/0216 ,  H01L33/52 ,  H01L31/18 ,  H01L33/44 ,  H01L31/0203

Abstract: An optical device includes a substrate, a light receiving component, an encapsulant, a coupling layer and a light shielding layer. The light receiving component is disposed on the substrate. The encapsulant covers the light receiving component. The coupling layer is disposed on at least a portion of the encapsulant. The light shielding layer is disposed on the coupling layer.

公开(公告)号：US11888210B2

公开(公告)日：2024-01-30

申请号：US17396601

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun Chen ,  Ya-Wen Liao

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/42 ,  H01Q1/40 ,  H01Q21/06 ,  H01Q21/08 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q1/40 ,  H01Q1/422 ,  H01Q9/0414 ,  H01Q21/065 ,  H01Q21/08 ,  H01L2223/6677 ,  H01L2223/6688

Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.