公开(公告)号：US10375822B2

公开(公告)日：2019-08-06

申请号：US15379994

申请日：2016-12-15

Applicant: Advanced Micro Devices, Inc.

Inventor： Yuan Li ,  James R. Foppiano ,  Jonathan P. Dowling ,  Gerald J. Merits ,  Manjunath Shivappa ,  Wasim I. Ullah ,  Claude Hilbert

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40

Abstract: Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.

公开(公告)号：US20180177043A1

公开(公告)日：2018-06-21

申请号：US15379994

申请日：2016-12-15

Applicant: Advanced Micro Devices, Inc.

Inventor： Yuan Li ,  James R. Foppiano ,  Jonathan P. Dowling ,  Gerald J. Merits ,  Manjunath Shivappa ,  Wasim I. Ullah ,  Claude Hilbert

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H01P3/08 ,  H01P11/00

CPC classification number: H05K1/0245 ,  H01P3/081 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/116 ,  H05K3/4038

Abstract: Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.