公开(公告)号：US08455899B2

公开(公告)日：2013-06-04

申请号：US13074317

申请日：2011-03-29

Applicant: Yusuke Taguchi ,  Toshio Shiobara

Inventor： Yusuke Taguchi ,  Toshio Shiobara

IPC: H01L33/00 ,  H01L23/29 ,  F21V7/00 ,  C08K5/00

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.

Abstract translation: 本发明公开了一种树脂组合物，其包含100重量份的有机树脂和50-1000重量份的无机填料，其中10-100重量％的无机填料由稀土元素的氧化物组成。

公开(公告)号：US08173053B2

公开(公告)日：2012-05-08

申请号：US12480129

申请日：2009-06-08

Applicant: Yusuke Taguchi ,  Junichi Sawada

Inventor： Yusuke Taguchi ,  Junichi Sawada

IPC: B29D11/00 ,  C08L83/04 ,  C08L83/06

CPC classification number: C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  Y10T428/1352 ,  H01L2924/00014

Abstract: A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.

Abstract translation: 一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品， 电阻和最小变黄。 固化的组合物的导热率为1-10W / mK。 组合物可用于在光电子部件（通常为LED）上形成壳体。

公开(公告)号：US08012381B2

公开(公告)日：2011-09-06

申请号：US12480118

申请日：2009-06-08

Applicant: Yusuke Taguchi ,  Junichi Sawada

Inventor： Yusuke Taguchi ,  Junichi Sawada

IPC: B29D11/00 ,  C08L83/04 ,  C08L83/06

CPC classification number: C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/013 ,  C08K3/22 ,  H01L31/02161 ,  H01L33/56 ,  H01L2224/48091 ,  Y10T428/1352 ,  C08L2666/44 ,  C08L2666/54 ,  H01L2924/00014

Abstract: A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.

Abstract translation: 一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品， 电阻和最小变黄。 固化的组合物在350-400nm的波长下具有至少80％的反射率。 组合物可用于在光电子部件（通常为LED）上形成壳体。

公开(公告)号：US20100081748A1

公开(公告)日：2010-04-01

申请号：US12569433

申请日：2009-09-29

Applicant: Yusuke TAGUCHI ,  Junichi Sawada ,  Kenji Hagiwara ,  Shoichi Osada ,  Kazutoshi Tomiyoshi

Inventor： Yusuke TAGUCHI ,  Junichi Sawada ,  Kenji Hagiwara ,  Shoichi Osada ,  Kazutoshi Tomiyoshi

IPC: C08K3/22 ,  C08L83/04

CPC classification number: H01L23/296 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/22 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014

Abstract: The present invention provides a silicone resin composition for an optical semiconductor device, comprising(A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2  (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c

Abstract translation: 本发明提供一种光半导体装置用有机硅树脂组合物，其包含：（A）100质量份的重均分子量为500〜20000的有机聚硅氧烷，还原为聚苯乙烯，由下列平均组成式（ 1），（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）其中R1是具有1至4个碳原子的有机基团，a，b和c是满足下列等式的数字： 0.8和nlE; a＆nlE; 1.5,0.001和nlE; c＆nlE; 0.5和0.801≤n1E; a + b + c2，（B）3到200质量份白色颜料，（C）400 1000质量份除了所述白色颜料以外的无机填充材料，（D）0.01〜10质量份的缩合催化剂，（E）2〜50质量份的由有机聚硅氧烷构成的有机聚硅氧烷，所述直链二有机聚硅氧烷部分由 下式（2），其中R 2和R 3彼此独立地是选自羟基，烷基 具有1至3个碳原子的基团，环己基，乙烯基，苯基和烯丙基，其中m为5-50的整数。

公开(公告)号：US20090304961A1

公开(公告)日：2009-12-10

申请号：US12480118

申请日：2009-06-08

Applicant: Yusuke TAGUCHI ,  Junichi Sawada

Inventor： Yusuke TAGUCHI ,  Junichi Sawada

IPC: C08K5/09 ,  C08L83/06 ,  C08K3/22 ,  C08L79/04 ,  B32B1/02

CPC classification number: C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/013 ,  C08K3/22 ,  H01L31/02161 ,  H01L33/56 ,  H01L2224/48091 ,  Y10T428/1352 ,  C08L2666/44 ,  C08L2666/54 ,  H01L2924/00014

Abstract: A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.

Abstract translation: 一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品， 电阻和最小变黄。 固化的组合物在350-400nm的波长下具有至少80％的反射率。 组合物可用于在光电子部件（通常为LED）上形成壳体。

公开(公告)号：US20090239997A1

公开(公告)日：2009-09-24

申请号：US12405589

申请日：2009-03-17

Applicant: Yusuke TAGUCHI ,  Kazutoshi Tomiyoshi

Inventor： Yusuke TAGUCHI ,  Kazutoshi Tomiyoshi

IPC: C08L83/06

CPC classification number: C08L83/06 ,  C08G77/26 ,  C08G77/28 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.

Abstract translation: 提供了一种用于模制光学半导体壳体的白色热固性硅树脂组合物和诸如LED的光学半导体的壳体。 组合物包含（A）热固性有机聚硅氧烷，（B）白色颜料，（C）无机填料（不包括白色颜料），（D）缩合催化剂和（E）由下式表示的偶联剂： R3dSi（OR2）e其中R3表示含有巯基，缩水甘油基或氨基的有机基团，R2表示C1-4有机基团，d表示1或2，e表示2或3; 其中白色颜料（B）的含量在整个组合物中为1〜50重量％，白色颜料（B）和无机填料（C）的总含量在整个组合物中为70〜93重量％。 固化时，具有优异的白度，一致性和耐热，耐光，发黄，翘曲等特点。

公开(公告)号：US09303115B2

公开(公告)日：2016-04-05

申请号：US12637359

申请日：2009-12-14

Applicant: Masaki Hayashi ,  Yusuke Taguchi ,  Kazutoshi Tomiyoshi ,  Tomoyoshi Tada

Inventor： Masaki Hayashi ,  Yusuke Taguchi ,  Kazutoshi Tomiyoshi ,  Tomoyoshi Tada

IPC: C08K5/10 ,  C08L63/00 ,  C08G59/32 ,  C08G59/18 ,  C08G59/42 ,  C08L63/06 ,  H01L23/29 ,  H01L23/00 ,  H01L23/24

CPC classification number: C08G59/3245 ,  C08G59/186 ,  C08G59/42 ,  C08L63/00 ,  C08L63/06 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12  (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.

Abstract translation: 一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。 组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2， 并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。

公开(公告)号：US08193269B2

公开(公告)日：2012-06-05

申请号：US12766660

申请日：2010-04-23

Applicant: Yusuke Taguchi ,  Kenji Hagiwara ,  Junichi Sawada

Inventor： Yusuke Taguchi ,  Kenji Hagiwara ,  Junichi Sawada

IPC: C08K3/22

CPC classification number: C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/22 ,  C08L2205/035 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/3122 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/29499 ,  H01L2224/48091 ,  H01L2224/48247 ,  C08L2666/22 ,  C08L2666/14 ,  C08L2666/54 ,  C08L83/00 ,  H01L2924/00014

Abstract: Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2  (1) wherein R1 is monovalent hydrocarbon and a, b, and c are numbers such that: 0.8

Abstract translation: 用于光学半导体器件的硅树脂组合物提供固化产物，其中改善了器件中的翘曲和白度，耐热性和耐光性。 组合物包含：（A）式（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）的有机聚硅氧烷，其中R 1为一价烃，a，b和c为 ：0.8 <= a <= 1.5,0 <= b <= 0.3，0.001 <= c <= 0.5和0.801 <= a + b + c <2; （B）白色颜料; （C）除白色颜料以外的无机填料; （D）缩合催化剂; （E）衍生自异氰脲酸的环氧树脂; （F）包含单元R2SiO和单元RSiO1.5的有机聚硅氧烷，其中R是羟基，甲基，乙基，丙基，环己基，苯基，乙烯基或烯丙基; 和（G）下式的线性二有机聚硅氧烷，其中R 5和R 6是烷基，环己基，乙烯基，苯基或烯丙基，n是800至1200的整数。

公开(公告)号：US08044128B2

公开(公告)日：2011-10-25

申请号：US12872510

申请日：2010-08-31

Applicant: Junichi Sawada ,  Yusuke Taguchi

Inventor： Junichi Sawada ,  Yusuke Taguchi

IPC: C08K5/524

CPC classification number: C08K5/34926 ,  C08G59/3236 ,  C08G77/16 ,  C08K5/524 ,  C08L63/00 ,  C08L63/06 ,  C08L83/04 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  C08L83/00 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR1)(OR2)2 wherein R1 and R2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.

Abstract translation: 提供白色可热固化的硅酮/环氧树脂混合树脂组合物，其包含（A）可热固化的有机硅树脂，（B）三嗪衍生的环氧树脂组合物，（C）白色颜料，（D）无机填料和（ E）抗氧化剂。 抗氧化剂（E）是具有式：P（OR 1）（OR 2）2的亚磷酸酯化合物，其中R 1和R 2是至少6个碳原子的有机基团。 组分（A）和（B）以5:95至95:5的重量比存在。 该组合物有效地固化成保持耐热性，耐光性和长期改善强度的产品。

公开(公告)号：US20110241048A1

公开(公告)日：2011-10-06

申请号：US13074317

申请日：2011-03-29

Applicant: Yusuke TAGUCHI ,  Toshio Shiobara

Inventor： Yusuke TAGUCHI ,  Toshio Shiobara

IPC: H01L33/60 ,  F21V7/22 ,  C08K3/22 ,  C08L63/00 ,  C08L83/04

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.

Abstract translation: 本发明公开了一种树脂组合物，其包含100重量份的有机树脂和50至1,000重量份的无机填料，其中10至100重量％的无机填料由稀土元素的氧化物组成。