公开(公告)号：US07674656B2

公开(公告)日：2010-03-09

申请号：US11567249

申请日：2006-12-06

Applicant: Robert J. Wenzel ,  Matthew A. Ruston ,  David M. Wells

Inventor： Robert J. Wenzel ,  Matthew A. Ruston ,  David M. Wells

IPC: H01L21/00 ,  H01L23/02

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method that locates a plurality of die for forming a plurality of packaged integrated circuits. A frame is placed over the support structure, wherein the frame includes a plurality of openings therein and each opening of the plurality of openings has at least two walls. Each die of a plurality of die is placed over the support structure, wherein each die has at least two adjacent edges. The relative placing of the frame and the die results in each die being in an opening of the plurality of openings. Encapsulant is applied to the plurality of die. Either or both of the plurality of die and frame are moved in relation to the other in a manner that causes the two adjacent edges of each die of the plurality of die to substantially abut to and align with the two walls of an opening of the plurality of openings.

Abstract translation: 一种定位用于形成多个封装集成电路的多个管芯的方法。 框架放置在支撑结构上方，其中框架包括多个开口，多个开口的每个开口具有至少两个壁。 多个管芯的每个管芯被放置在支撑结构上，其中每个管芯具有至少两个相邻的边缘。 框架和模具的相对放置导致每个模具处于多个开口的开口中。 将密封剂施加到多个模具。 多个模具和框架中的一个或两个相对于另一个模具和框架以使得多个模具的每个模具的两个相邻边缘基本上抵接并与多个模具的开口的两个壁对齐的方式移动 的开口。

公开(公告)号：US20080138938A1

公开(公告)日：2008-06-12

申请号：US11567249

申请日：2006-12-06

Applicant: Robert J. Wenzel ,  Matthew A. Ruston ,  David M. Wells

Inventor： Robert J. Wenzel ,  Matthew A. Ruston ,  David M. Wells

IPC: H01L21/00

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method that locates a plurality of die for forming a plurality of packaged integrated circuits. A frame is placed over the support structure, wherein the frame includes a plurality of openings therein and each opening of the plurality of openings has at least two walls. Each die of a plurality of die is placed over the support structure, wherein each die has at least two adjacent edges. The relative placing of the frame and the die results in each die being in an opening of the plurality of openings. Encapsulant is applied to the plurality of die. Either or both of the plurality of die and frame are moved in relation to the other in a manner that causes the two adjacent edges of each die of the plurality of die to substantially abut to and align with the two walls of an opening of the plurality of openings.

Abstract translation: 一种定位用于形成多个封装集成电路的多个管芯的方法。 框架放置在支撑结构上方，其中框架包括多个开口，多个开口的每个开口具有至少两个壁。 多个管芯的每个管芯被放置在支撑结构上，其中每个管芯具有至少两个相邻的边缘。 框架和模具的相对放置导致每个模具处于多个开口的开口中。 将密封剂施加到多个模具。 多个模具和框架中的一个或两个相对于另一个模具和框架以使得多个模具的每个模具的两个相邻边缘基本上抵接并与多个模具的开口的两个壁对齐的方式移动 的开口。