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1.

发明授权
凸起的形成方法、半导体器件的制造方法失效

公开(公告)号：CN1294635C

公开(公告)日：2007-01-10

申请号：CN01120712.4

申请日：2001-04-28

Applicant: 精工爱普生株式会社

Inventor： 樱井和德 , 太田勉 , 松岛文明 , 间箇部

IPC: H01L21/60 , H01L21/28 , H01L21/768 , H01L23/48

CPC classification number: H01L24/12 , H01L23/3128 , H01L24/11 , H01L24/16 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/1182 , H01L2224/11849 , H01L2224/11901 , H01L2224/13076 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13566 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13644 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81894 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/29075

Abstract: 提供了一种能够以期望的宽度简单地形成凸起的凸起形成方法、半导体器件及其制造方法、电路板和电子机器。凸起的形成方法为在绝缘膜15上形成露出焊盘12的至少一部分的开口部16，形成与上述焊盘12连接的凸起，形成具有与上述焊盘12的至少一部分平面地重叠的通孔22的抗蚀层20，在上述绝缘膜15中形成开口部16，形成与通过上述开口部16露出的上述焊盘12连接的金属层。

2.

发明公开
凸起的形成方法、半导体器件及其制造方法、电路板及电子机器失效

公开(公告)号：CN1322010A

公开(公告)日：2001-11-14

申请号：CN01120712.4

申请日：2001-04-28

Applicant: 精工爱普生株式会社

Inventor： 樱井和德 , 太田勉 , 松岛文明 , 间箇部

IPC: H01L21/60 , H01L21/28 , H01L21/768 , H01L23/48

CPC classification number: H01L24/12 , H01L23/3128 , H01L24/11 , H01L24/16 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/1182 , H01L2224/11849 , H01L2224/11901 , H01L2224/13076 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13566 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13644 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81894 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/29075

Abstract: 提供了一种能够以期望的宽度简单地形成凸起的凸起形成方法、半导体器件及其制造方法、电路板和电子机器。凸起的形成方法为在绝缘膜15上形成露出焊盘12的至少一部分的开口部16,形成与上述焊盘12连接的凸起,形成具有与上述焊盘12的至少一部分平面地重叠的通孔22的抗蚀层20,在上述绝缘膜15中形成开口部16,形成与通过上述开口部16露出的上述焊盘12连接的金属层。

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