Invention Grant
- Patent Title: Wafers having a die region and a scribe-line region adjacent to the die region
-
Application No.: US14992013Application Date: 2016-01-10
-
Publication No.: US09865516B2Publication Date: 2018-01-09
- Inventor: Tzung-Han Lee , Chun-Yi Wu , Sheng-Yu Yan , Yi-Ting Cheng
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/528 ; H01L23/00 ; H01L21/768 ; H01L23/522
Abstract:
A wafer and a forming method thereof are provided. The wafer has a die region and a scribe-line region adjacent to the die region, and includes a conductive bonding pad in the die region of the wafer and a wafer acceptance test (WAT) pad in the scribe-line region of the wafer. A top surface of the WAT pad is lower than a top surface of the conductive bonding pad.
Public/Granted literature
- US20170200661A1 WATERS HAVING A DIE REGION AND A SCRIBE-LINE REGION ADJACENT TO THE DIE REGION Public/Granted day:2017-07-13
Information query
IPC分类:
