Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
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Application No.: US15053913Application Date: 2016-02-25
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Publication No.: US09640648B2Publication Date: 2017-05-02
- Inventor: Toshihide Kikkawa
- Applicant: Transphorm Japan, Inc.
- Applicant Address: JP Yokohama
- Assignee: Transphorm Japan, Inc.
- Current Assignee: Transphorm Japan, Inc.
- Current Assignee Address: JP Yokohama
- Agency: Fish & Richardson P.C.
- Priority: JP2012-218244 20120928
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/20 ; H01L29/205 ; H01L29/207 ; H01L29/10

Abstract:
A semiconductor device includes a first semiconductor layer formed on a substrate; a second semiconductor layer and a third semiconductor layer formed on the first semiconductor layer; a fourth semiconductor layer formed on the third semiconductor layer; a gate electrode formed on the fourth semiconductor layer; and a source electrode and a drain electrode formed in contact with the second semiconductor layer. The third semiconductor layer and the fourth semiconductor layer are formed in an area immediately below the gate electrode, the fourth semiconductor layer is formed with a p-type semiconductor material, and the second semiconductor layer and the third semiconductor layer are formed with AlGaN, and the third semiconductor layer has a lower composition ratio of Al than that of the second semiconductor layer.
Public/Granted literature
- US20160172476A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2016-06-16
Information query
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