Invention Grant
- Patent Title: Composite materials comprising conductive nano-fillers
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Application No.: US14356653Application Date: 2012-12-19
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Publication No.: US09640297B2Publication Date: 2017-05-02
- Inventor: Carmelo Luca Restuccia , Fiorenzo Lenzi , Emiliano Frulloni , Natalie Denise Jordan , Mark Edward Harriman
- Applicant: Cytec Technology Corp.
- Applicant Address: US DE Wilmington
- Assignee: CYTEC TECHNOLOGY CORP.
- Current Assignee: CYTEC TECHNOLOGY CORP.
- Current Assignee Address: US DE Wilmington
- Agent Thi Dang
- Priority: GB1122296.5 20111223
- International Application: PCT/US2012/070472 WO 20121219
- International Announcement: WO2013/141916 WO 20130926
- Main IPC: H01B1/06
- IPC: H01B1/06 ; H01B1/24 ; H01B1/22 ; C08K3/04 ; C08K7/24

Abstract:
A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.
Public/Granted literature
- US20140306164A1 COMPOSITE MATERIALS COMPRISING CONDUCTIVE NANO-FILLERS Public/Granted day:2014-10-16
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