Invention Grant
- Patent Title: Light-emitting device package and method of manufacturing thereof
- Patent Title (中): 发光元件封装及其制造方法
-
Application No.: US14618114Application Date: 2015-02-10
-
Publication No.: US09590156B2Publication Date: 2017-03-07
- Inventor: Jae Sik Min , Jae Young Jang , Jae Yeop Lee , Byoung Gu Cho
- Applicant: LIGHTIZER KOREA CO.
- Applicant Address: KR Seoul
- Assignee: LIGHTIZER KOREA CO.
- Current Assignee: LIGHTIZER KOREA CO.
- Current Assignee Address: KR Seoul
- Agency: Keohane & D'Alessandro PLLC
- Agent Madeline F. Schiesser
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L33/62 ; H01L33/50 ; H01L33/56 ; H01L33/54
Abstract:
The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.
Public/Granted literature
- US20160118559A1 LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2016-04-28
Information query
IPC分类:
