An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is provided with an inclined portion on a surface of the board terminal, the inclined portion being the wider as closer to a base end side toward a peripheral edge. A position of the component terminal is offset in relation to a position of the corresponding board terminal. A position of the other component terminal is offset in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal. The component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal.