Invention Grant
- Patent Title: Flexible microsystem structure
- Patent Title (中): 灵活的微系统结构
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Application No.: US14596079Application Date: 2015-01-13
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Publication No.: US09412692B2Publication Date: 2016-08-09
- Inventor: Yu-Ting Cheng , Yu-Min Fu
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L23/498 ; H01L23/00
Abstract:
A flexible microsystem structure is provided. The flexible microsystem structure includes a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements.
Public/Granted literature
- US20160204051A1 FLEXIBLE MICROSYSTEM STRUCTURE Public/Granted day:2016-07-14
Information query
IPC分类:
