Invention Grant
- Patent Title: Package structures and methods for forming the same
- Patent Title (中): 包装结构及其形成方法
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Application No.: US13788135Application Date: 2013-03-07
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Publication No.: US09362236B2Publication Date: 2016-06-07
- Inventor: Hsien-Liang Meng , Wei-Hung Lin , Jimmy Liang , Ming-Che Ho , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/78 ; H01L23/31 ; H01L21/56 ; H01L21/683 ; H01L23/498 ; H01L21/48 ; H01L23/538 ; H01L25/18
Abstract:
A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.
Public/Granted literature
- US20140252594A1 Package Structures and Methods for Forming the Same Public/Granted day:2014-09-11
Information query
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