Invention Grant
- Patent Title: Nonvolatile memory device and method for manufacturing the same
- Patent Title (中): 非易失性存储器件及其制造方法
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Application No.: US11275494Application Date: 2006-01-10
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Publication No.: US07989874B2Publication Date: 2011-08-02
- Inventor: Da-Soon Lee
- Applicant: Da-Soon Lee
- Applicant Address: KR Cheongju-si
- Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2003-0078099 20031105
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
The present invention discloses a nonvolatile memory device which can improve the data storage capacity without increasing the surface area of the device, and a method for manufacturing the same. The nonvolatile memory device comprises: a gate of a stack type structure formed on an active region of a semiconductor substrate; a source/drain formed in the substrate at both sides of the gate of the stack type structure; an interlayer insulating film formed on the substrate where the source/drain is formed and covering the gate of the stack type structure; a contact connected to the source/drain through the interlayer insulating film; a plurality of conductive patterns formed in the interlayer insulating film of the region not adjacent to the contact; and an electrode pad formed on the conductive patterns.
Public/Granted literature
- US20060102951A1 Nonvolatile Memory Device and Method for Manufacturing the Same Public/Granted day:2006-05-18
Information query
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