The present invention discloses a structure of package comprising: a substrate with a die receiving through hole and a contact conductive via formed therein, a die disposed within the die receiving through hole, a surrounding material filled in the gap except the die area of the die receiving though hole, a re-distribution layer formed on the substrate and coupled to the contact conductive via, a protection layer formed over the re-distribution layer, a cover material formed over the protection layer; and a terminal contact pad formed on the lower surface of the substrate and under the contact conductive via and the die to couple the contact conductive via.