公开(公告)号：US07884461B2

公开(公告)日：2011-02-08

申请号：US12217086

申请日：2008-06-30

Applicant: Dyi-Chung Hu ,  Chun-Hui Yu

Inventor： Dyi-Chung Hu ,  Chun-Hui Yu

IPC: H01L23/48

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The present invention discloses a structure of package comprising: a substrate with a die receiving through hole and a contact conductive via formed therein, a die disposed within the die receiving through hole, a surrounding material filled in the gap except the die area of the die receiving though hole, a re-distribution layer formed on the substrate and coupled to the contact conductive via, a protection layer formed over the re-distribution layer, a cover material formed over the protection layer; and a terminal contact pad formed on the lower surface of the substrate and under the contact conductive via and the die to couple the contact conductive via.

Abstract translation: 本发明公开了一种包装体的结构，其特征在于，包括具有模片接收通孔的基板和形成在其中的接触导电通孔，设置在模具接收通孔内的模具，填充在除模具的模具区域之外的间隙中的周围材料 接收通孔，形成在基板上并耦合到接触导电通孔的再分布层，形成在再分布层上的保护层，形成在保护层上的覆盖材料; 以及端子接触焊盘，其形成在所述基板的下表面上并且在所述接触导电通孔和所述管芯下方以耦合所述接触导电通孔。