Invention Grant
- Patent Title: Configurable high-speed memory interface subsystem
- Patent Title (中): 可配置的高速内存接口子系统
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Application No.: US12250017Application Date: 2008-10-13
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Publication No.: US07865661B2Publication Date: 2011-01-04
- Inventor: Derrick Sai-Tang Butt , Cheng-Gang Kong , Terence J. Magee
- Applicant: Derrick Sai-Tang Butt , Cheng-Gang Kong , Terence J. Magee
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Christopher P. Maiorana, PC
- Main IPC: G06F12/00
- IPC: G06F12/00

Abstract:
A memory interface subsystem including a write logic and a read logic. The write logic may be configured to communicate data from a memory controller to a memory. The read logic may be configured to communicate data from the memory to the memory controller. The read logic may comprise a plurality of physical read datapaths. Each of the physical read datapaths may be configured to receive (i) a respective portion of read data signals from the memory, (ii) a respective read data strobe signal associated with the respective portion of the received read data signals, (iii) a gating signal, (iv) a base delay signal and (v) an offset delay signal.
Public/Granted literature
- US20090043955A1 Configurable high-speed memory interface subsystem Public/Granted day:2009-02-12
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