Invention Grant
- Patent Title: Stack position location identification for memory stacked packages
- Patent Title (中): 存储器堆叠包的堆栈位置位置标识
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Application No.: US11862802Application Date: 2007-09-27
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Publication No.: US07791918B2Publication Date: 2010-09-07
- Inventor: Paul Ruby
- Applicant: Paul Ruby
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Cool Patent, P.C.
- Agent Joseph P. Curtin
- Main IPC: G11C5/02
- IPC: G11C5/02
Abstract:
A method for use with devices in a stacked package is discussed. By preprogramming a unique identifier into a device during manufacture, the device can determine its position in the stack and perform a task based on its position in the stack. In one embodiment, the task is power-up.
Public/Granted literature
- US20090084838A1 STACK POSITION LOCATION IDENTIFICATION FOR MEMORY STACKED PACKAGES Public/Granted day:2009-04-02
Information query
