Invention Grant
- Patent Title: Embedded terminal module and connector and manufacturing and assembling method thereof
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Application No.: US17037469Application Date: 2020-09-29
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Publication No.: US12034242B2Publication Date: 2024-07-09
- Inventor: Kuo-Chi Yu
- Applicant: Chia-Hsin Wang
- Applicant Address: TW New Taipei
- Assignee: Chia-Hsin Wang
- Current Assignee: Chia-Hsin Wang
- Current Assignee Address: TW New Taipei
- Agent Ying-Ting Chen
- Main IPC: B29C70/72
- IPC: B29C70/72 ; H01R13/11 ; H01R13/20 ; H01R13/627 ; H01R13/05
Abstract:
A method of manufacturing and assembling an embedded terminal module, comprising the steps of: (A) placing a terminal component in a mold; (B) a mating component partially over the terminal component to form a mating terminal component; (C) assembling at least two mating terminal component in a mirror-aligned manner to a mating socket to form the embedded terminal module.
Public/Granted literature
- US20220102895A1 Embedded Terminal Module and Connector and Manufacturing and Assembling Method Thereof Public/Granted day:2022-03-31
Information query
