Invention Grant
- Patent Title: Heat sink
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Application No.: US16642747Application Date: 2017-08-29
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Publication No.: US11948860B2Publication Date: 2024-04-02
- Inventor: Yutaka Suzuki , Takashi Saito , Shingo Ikarashi
- Applicant: WELCON Inc.
- Applicant Address: JP Niigata
- Assignee: WELCON Inc.
- Current Assignee: WELCON Inc.
- Current Assignee Address: JP Niigata
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/031029 2017.08.29
- International Announcement: WO2019/043801A 2019.03.07
- Date entered country: 2020-02-27
- Main IPC: H01L23/473
- IPC: H01L23/473 ; F28F3/12 ; F28F13/06

Abstract:
A multilayer heat sink including a heat-receiving layer, a channel layer including cooling micropaths extending and directing a fluid in a direction orthogonal to a stacking direction, an orifice layer including jet orifices configured to jet the fluid into the cooling micropaths, and drain orifices configured to drain the fluid from the cooling micropaths, a header layer including a peripheral wall and a baffle, and a bottom layer, wherein the baffle includes parallel plates disposed parallel to each other, and end plates configured to alternately close an opening at an end and an opening at an opposite end of the parallel plates, and the orifice layer, the bottom layer, the baffle, and the peripheral wall define a supply channel to guide the fluid from a fluid inlet to the jet orifices and a drain channel to guide the fluid from the drain orifices to a fluid outlet.
Public/Granted literature
- US20200258815A1 HEAT SINK Public/Granted day:2020-08-13
Information query
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