Invention Grant
- Patent Title: Shielding structure, semiconductor package structure with shielding structure
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Application No.: US17009601Application Date: 2020-09-01
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Publication No.: US11380625B2Publication Date: 2022-07-05
- Inventor: Soonheung Bae , Jyhwan Lee , Jaeshin Cho
- Applicant: Advanced Semiconductor Engineering Korea, Inc.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Advanced Semiconductor Engineering Korea, Inc.
- Current Assignee: Advanced Semiconductor Engineering Korea, Inc.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/268
- IPC: H01L21/268 ; H01L23/552 ; H01L25/065
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a first device, a second device, and a shielding structure. The first device and the second device is one a first side of a substrate. The shielding structure includes a first portion and a second portion. The first portion is between the first device and the second device on the substrate, and the first portion includes a plurality of first shielding units arranged along a first direction. The second portion is between the first device and the second device, and the second portion includes a plurality of second shielding units arranged along a second direction different from the first direction. The second portion is configured as a first waveguide between the first device and the second device.
Public/Granted literature
- US20220068831A1 SHIELDING STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE WITH SHIELDING STRUCTURE Public/Granted day:2022-03-03
Information query
IPC分类:
