An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.