Invention Grant
- Patent Title: Electronic devices with ultra-high dielectric constant passivation and high mobility materials
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Application No.: US16455736Application Date: 2019-06-27
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Publication No.: US11081555B2Publication Date: 2021-08-03
- Inventor: Siddharth Rajan , Zhanbo Xia , Caiyu Wang
- Applicant: Ohio State Innovation Foundation
- Applicant Address: US OH Columbus
- Assignee: Ohio State Innovation Foundation
- Current Assignee: Ohio State Innovation Foundation
- Current Assignee Address: US OH Columbus
- Agency: Meunier Carlin & Curfman LLC
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/49 ; H01L29/51 ; H01L29/778 ; H01L29/861 ; H01L29/872

Abstract:
Dielectric super-junction transistors use combinations high dielectric relative permittivity materials and high-mobility materials. An associated electronic device includes a junction portion of a barrier layer adjacent a gate contact and a drain contact. A layered semiconductor device is configured with a junction dielectric permittivity that is greater than a channel dielectric permittivity in the channel layer. The junction portion has a dielectric structure that polarizes carriers within the junction portion such that excess charge on the gate is compensated by an opposite charge in the junction portion of the barrier layer proximate the gate. A sheet charge in the barrier layer is increased to form a depletion region with the channel layer that avoids a conductive parallel channel in the barrier layer to the drain contact.
Public/Granted literature
- US20200006500A1 Dielectric Passivation for Electronic Devices Public/Granted day:2020-01-02
Information query
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