Invention Grant
- Patent Title: Copper foil having improved adhesive force, electrode including the same, secondary battery including the same, and method of manufacturing the same
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Application No.: US15914568Application Date: 2018-03-07
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Publication No.: US10741848B2Publication Date: 2020-08-11
- Inventor: Seung Min Kim , Shan Hua Jin
- Applicant: LS MTRON LTD.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: KCF TECHNOLOGIES CO., LTD
- Current Assignee: KCF TECHNOLOGIES CO., LTD
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@66913219
- Main IPC: H01M4/66
- IPC: H01M4/66 ; H01M4/133 ; C25D3/38 ; C25D7/06 ; C25D1/04 ; C23C22/37 ; C25D5/04 ; C25D5/48 ; C25D1/20 ; H01M4/13 ; H01M4/587 ; H01M4/48 ; H01M4/02 ; H01M10/0525 ; H01M4/36
Abstract:
Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 μm to 3.5 μm, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
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