Invention Grant
- Patent Title: Semiconductor devices with via structure and package structures comprising the same
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Application No.: US15358469Application Date: 2016-11-22
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Publication No.: US10741644B2Publication Date: 2020-08-11
- Inventor: Shiau-Shi Lin , Tzu-Hsuan Cheng , Hsin-Chang Tsai
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L23/522 ; H01L29/66 ; H01L23/367 ; H01L23/31
Abstract:
A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.
Public/Granted literature
- US20180145018A1 SEMICONDUCTOR DEVICES AND PACKAGE STRUCTURES COMPRISING THE SAME Public/Granted day:2018-05-24
Information query
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