Invention Grant
- Patent Title: Light emitting diode and fabrication method thereof
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Application No.: US16522634Application Date: 2019-07-25
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Publication No.: US10707381B2Publication Date: 2020-07-07
- Inventor: Cheng Meng , Yuehua Jia , Jing Wang , Chun-Yi Wu , Ching-Shan Tao , Duxiang Wang
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@37fdbf4f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4cfab87a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@593527fb com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6131349e
- Main IPC: H01L33/42
- IPC: H01L33/42 ; H01L33/40 ; H01L33/44 ; H01L33/38 ; H01L33/00 ; H01L33/30

Abstract:
A light-emitting diode includes a light-emitting epitaxial laminated layer having a first surface and a second, opposing, surface, including an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer; an omnidirectional reflector structure formed on the second surface of the light-emitting epitaxial laminated layer, including a transparent dielectric layer located on the second surface of the light-emitting epitaxial laminated layer and having conductive holes therein; a first transparent adhesive layer on one side surface of the transparent dielectric layer that is distal from the light-emitting epitaxial laminated layer; a second transparent adhesive layer on one side surface of the first transparent adhesive layer that is distal from the transparent dielectric layer; and a metal reflective layer on one side surface of the second transparent adhesive layer that is distal from the first transparent adhesive layer.
Information query
IPC分类: